Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate;
an internal circuit provided on the semiconductor substrate;
a plurality of external connection pads provided on the semiconductor substrate and electrically connected to the internal circuit to transmit and receive signals to and from an outside of the semiconductor device;
an inductor provided on the semiconductor substrate and including the internal circuit and the plurality of external connection pads and connected to the internal circuit;
a shield member provided on the semiconductor substrate and positioned among the inductor, the internal circuit, and the plurality of external connection pads;
a power supply circuit provided on the semiconductor substrate; and
a power supply receiving inductor for supplying power to the internal circuit,wherein the power supply receiving inductor is connected to the power supply circuit and supplies power to the internal circuit via the power supply circuit, andwherein the plurality of external connection pads include a power supply external connection pad and a plurality of signal external connection pads.
1 Assignment
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Accused Products
Abstract
A semiconductor device includes a semiconductor substrate including a semiconductor chip formation region, a chip internal circuit provided within the semiconductor chip formation region of the semiconductor substrate, a signal transmitting/receiving unit which is provided within the semiconductor chip formation region of the semiconductor substrate, transmits/receives a signal to/from an outside in a non-contact manner by one of electromagnetic induction and capacitive coupling, and transmits/receives a signal to/from the chip internal circuit through electrical connection to the chip internal circuit, and a power receiving inductor which has a diameter provided along an outer edge of the semiconductor chip formation region of the semiconductor substrate so as to surround the chip internal circuit and the signal transmitting/receiving unit, receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit.
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Citations
2 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; an internal circuit provided on the semiconductor substrate; a plurality of external connection pads provided on the semiconductor substrate and electrically connected to the internal circuit to transmit and receive signals to and from an outside of the semiconductor device; an inductor provided on the semiconductor substrate and including the internal circuit and the plurality of external connection pads and connected to the internal circuit; a shield member provided on the semiconductor substrate and positioned among the inductor, the internal circuit, and the plurality of external connection pads; a power supply circuit provided on the semiconductor substrate; and a power supply receiving inductor for supplying power to the internal circuit, wherein the power supply receiving inductor is connected to the power supply circuit and supplies power to the internal circuit via the power supply circuit, and wherein the plurality of external connection pads include a power supply external connection pad and a plurality of signal external connection pads. - View Dependent Claims (2)
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Specification