RFID tag assembly methods

• US 10,116,033 B1
• Filed: 02/11/2016
• Issued: 10/30/2018
• Est. Priority Date: 03/11/2008
• Status: Active Grant

• Current Assignee: Impinj, Inc.
• Original Assignee: Impinj, Inc.
• Inventors: Koepp, Ronald L., Oliver, Ronald A., Colleran, William T., Ma, Yanjun, Fassett, Jay M., Moretti, Vincent C.
• Primary Examiner(s): Trinh, Minh
• Application Number:
  US15/041,041
• Time in Patent Office: 992 Days
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.

Claims

1. A method for assembling a Radio Frequency Identification (RFID) tag, the method comprising:

providing an antenna;

providing an integrated circuit (IC) that includes a first electrical bus and electrical circuitry, the electrical circuitry comprising one or more of a rectifier circuit, a demodulator circuit, and a modulator circuit of the IC, wherein providing the IC comprises;

coupling the first electrical bus to the one or more of a rectifier circuit, a demodulator circuit, and a modulator circuit of the IC;

disposing a plurality of conductive patches on a surface of the IC, wherein the plurality of distinct conductive patches covers a substantial portion of the surface of the IC;

capacitively coupling at least a first one of the plurality of distinct conductive patches to the first electrical bus; and

coupling the antenna to the plurality of distinct conductive patches on the surface of the IC to form the RFID tag, wherein at least one of the antenna-to-conductive-patch and the first-electrical-bus-to-conductive-patch couplings is through a dielectric material and the dielectric material includes at least one of a covering layer of the antenna and a covering layer of the IC.

2. The method of claim 1, wherein the covering layer of the antenna includes an oxide layer formed on the antenna.

3. The method of claim 1, further comprising forming the dielectric layer of the IC from an organic material.

4. The method of claim 1, further comprising galvanically coupling the first one of the conductive patches to the antenna.

5. The method of claim 1, wherein the first electrical bus is galvanically coupled to the at least one rectifier circuit, demodulator circuit, and modulator circuit.

6. The method of claim 1, wherein a first capacitor in the IC provides the only coupling between the first conductive patch and the first electrical bus.

7. The method of claim 6, wherein:

a second capacitor in the IC provides the only coupling between a second one of the plurality of conductive patches and a second electrical bus of the IC; and

the second electrical bus is coupled to at least one of the rectifier circuit, the demodulator circuit, and the modulator circuit.