Edge construction on optical devices
First Claim
Patent Images
1. A method of forming an optical device, comprising:
- obtaining a wafer having multiple optical device dies that each includes a waveguide;
forming a facet on the waveguide of different dies; and
separating the dies from the wafer after forming the facets, the dies being separated from the wafer such that the facets are positioned at an edge of the dies, and separating the dies forms an edge wall at a lateral side of at least one of the dies such that the edge wall has a displacement distance of less than 2 μ
m from the facet, the displacement distance being the shortest distance that the waveguide on the at least one die can moved laterally before a portion of the waveguide is aligned with the edge wall.
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Abstract
A method of forming an optical device includes obtaining a wafer having multiple optical device dies that each includes a waveguide. The method also includes forming a facet on the waveguide of different dies. The method further includes separating the dies from the wafer after forming the facets. The dies are separated from the wafer such that the facets are positioned at an edge of the dies.
19 Citations
20 Claims
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1. A method of forming an optical device, comprising:
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obtaining a wafer having multiple optical device dies that each includes a waveguide; forming a facet on the waveguide of different dies; and separating the dies from the wafer after forming the facets, the dies being separated from the wafer such that the facets are positioned at an edge of the dies, and separating the dies forms an edge wall at a lateral side of at least one of the dies such that the edge wall has a displacement distance of less than 2 μ
m from the facet, the displacement distance being the shortest distance that the waveguide on the at least one die can moved laterally before a portion of the waveguide is aligned with the edge wall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of forming an optical device, comprising:
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obtaining a wafer having multiple optical device dies that each includes a waveguide; forming a facet on the waveguide of different dies; and separating the dies from the wafer after forming the facets, the dies being separated from the wafer such that the facets are positioned at an edge of the dies, at least one of the separated dies is constructed such that the facet is positioned above a facet shelf that extends outward from the facet to a recess wall, a recess shelf extends outwards from the recess wall to an edge wall with the edge wall being an outermost side of the optical device; and attaching an optical fiber to one of the separated dies such that the optical fiber is optically aligned with the facet, the optical fiber being positioned such that an imaginary line can be drawn perpendicular to an end of the optical fiber and through the edge wall. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification