Method and apparatus for cooling components in an electronic device
First Claim
1. An electronic device comprising:
- electromechanical components;
a memory configured to store, for each of the electromechanical components, a plurality of predetermined temperature states, a plurality of system actions associated with the plurality of predetermined temperature states, and a ranking of the system actions;
a cooling unit configured to remove heat from the electromechanical components; and
a controller configured to;
determine an individual temperature state for each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein;
each determined individual temperature state is one of the plurality of predetermined temperature states;
at least one of the determined individual temperature states is different from at least one other of the determined individual temperature states;
each of the electromechanical components is sampled at an individual sample rate based at least partly on a temperature fluctuation rate of each of the electromechanical components, as determined through a thermal time constant related to a thermal mass of a corresponding electromechanical component;
andthe temperature data for each of the electromechanical components is sampled at the individual sample rate corresponding to each of the electromechanical components;
during overheating and non-overheating operation of the electronic device, assign a device temperature state to the electronic device based on a highest ranked temperature state of the determined individual temperature states;
andresponsive to at least a first electromechanical component and a second electromechanical component having individual temperature states that match the assigned device temperature state;
determine a first system action and a second system action associated with the first electromechanical component and the second electromechanical component, respectively, wherein the first system action and the second system action are different for a same determined individual temperature state;
determine a device system action for the electronic device by selecting one of the first system action or the second system action based on the ranking of the system actions;
andcontrol an operation of the cooling unit based on the determined device system action.
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Accused Products
Abstract
An electronic device including electromechanical components, a cooling unit configured for heat removal for the electromechanical components, and a controller. The controller is configured to determine a system state of each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein the temperature data for each of the electromechanical components is sampled at a sample rate corresponding to each of the electromechanical components, determine a system state of the electronic device based on the system states of the electromechanical components, and control an operation of the cooling unit based on the system state of the electronic device.
14 Citations
19 Claims
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1. An electronic device comprising:
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electromechanical components; a memory configured to store, for each of the electromechanical components, a plurality of predetermined temperature states, a plurality of system actions associated with the plurality of predetermined temperature states, and a ranking of the system actions; a cooling unit configured to remove heat from the electromechanical components; and a controller configured to; determine an individual temperature state for each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein; each determined individual temperature state is one of the plurality of predetermined temperature states; at least one of the determined individual temperature states is different from at least one other of the determined individual temperature states; each of the electromechanical components is sampled at an individual sample rate based at least partly on a temperature fluctuation rate of each of the electromechanical components, as determined through a thermal time constant related to a thermal mass of a corresponding electromechanical component; and the temperature data for each of the electromechanical components is sampled at the individual sample rate corresponding to each of the electromechanical components; during overheating and non-overheating operation of the electronic device, assign a device temperature state to the electronic device based on a highest ranked temperature state of the determined individual temperature states; and responsive to at least a first electromechanical component and a second electromechanical component having individual temperature states that match the assigned device temperature state; determine a first system action and a second system action associated with the first electromechanical component and the second electromechanical component, respectively, wherein the first system action and the second system action are different for a same determined individual temperature state; determine a device system action for the electronic device by selecting one of the first system action or the second system action based on the ranking of the system actions; and control an operation of the cooling unit based on the determined device system action. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for removing heat from electromechanical components in an electronic device, the method comprising:
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storing in the electronic device, for each of the electromechanical components, a plurality of predetermined temperature states, a plurality of system actions associated with the plurality of predetermined temperature states, and a ranking of the system actions; determining an individual temperature state for each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components using a controller in the electronic device, wherein; each determined individual temperature state is one of the plurality of predetermined temperature states; at least one of the determined individual temperature states is different from at least one other of the determined individual temperature states; each of the electromechanical components is sampled at an individual sample rate based at least partly on a temperature fluctuation rate of each of the electromechanical components, as determined through a thermal time constant related to a thermal mass of a corresponding electromechanical component; and the temperature data for each of the electromechanical components is sampled at the individual sample rate corresponding to each of the electromechanical components; during overheating and non-overheating operation of the electronic device, assigning a device temperature state of the electronic device based on a highest ranked temperature state of the determined individual temperature states; and responsive to at least a first electromechanical component and a second electromechanical component having individual temperature states that match the assigned device temperature state of the electronic device; determining a first system action and a second system action associated with the first electromechanical component and the second electromechanical component, respectively, wherein the first system action and the second system action are different for a same determined individual state;
determining a device system action for the electronic device by selecting one of the first system action or the second system action based on the ranking of the system actions; andcontrolling an operation of a cooling unit in the electronic device based on the determined device system action. - View Dependent Claims (10, 11, 12, 13)
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14. A temperature modification system for an electronic device, the system comprising:
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a temperature modification unit configured to add heat to or remove heat from electromechanical components in the electronic device; a memory configured to store, for each of the electromechanical components, a plurality of predetermined temperature states, a plurality of system actions associated with the plurality of predetermined temperature states, and a ranking of the system actions; and a controller configured to; determine an individual temperature state for each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein; each determined individual temperature state is one of a set of predetermined temperature states; at least one of the determined individual temperature states is different from at least one other of the determined individual temperature states; each of the electromechanical components is sampled at an individual sample rate based at least partly on a temperature fluctuation rate of each of the electromechanical components, as determined through a thermal time constant related to a thermal mass of a corresponding electromechanical component; and the temperature data for each of the electromechanical components is sampled at the individual sample rate corresponding to each of the electromechanical components; during overheating and non-overheating operation of the electronic device, assign a device temperature state of the electronic device based on a highest ranked temperature state of the determined individual temperature states; and responsive to at least a first electromechanical component and a second electromechanical component having individual temperature states that match the assigned device temperature state; determine a first system action and a second system action associated with the first electromechanical component and the second electromechanical component, respectively, wherein the first system action and the second system action are different for a same determined individual state; determine a device system action for the electronic device by selecting one of the first system action or the second system action based on the ranking of the system actions; and control an operation of the temperature modification unit based on the determined device system action. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification