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Integrated fan-out package and layout method thereof

  • US 10,120,971 B2
  • Filed: 08/30/2016
  • Issued: 11/06/2018
  • Est. Priority Date: 08/30/2016
  • Status: Active Grant
First Claim
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1. An integrated fan-out package, comprising:

  • a die having an interconnect structure therein; and

    a fan-out substrate having a conductive redistribution layer structure therein and a plurality of first conductive bumps on a first surface thereof,wherein the first conductive bumps are in physical contact with an interconnect layer of the interconnect structure and a conductive redistribution layer of the conductive redistribution layer structure,wherein the fan-out substrate further has a plurality of second conductive bumps on the first surface thereof and aside the first conductive bumps, and the second conductive bumps are not in physical contact with the interconnect layer but in physical contact with the conductive redistribution layer, andwherein the first and second conductive bumps are overlapped with each of the fan-out substrate and the die, and an underfill layer encapsulates the first and second conductive bumps.

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