Purging of porogen from UV cure chamber
First Claim
1. A method for removing chemical species from a substrate, comprising:
- arranging a purge ring in a chamber above (i) a pedestal and (ii) a purge space defined above the pedestal, the purge ring includingan inlet ring wall defining a ring hole space above the purge space, wherein the inlet ring wall corresponds to a continuous structure surrounding the ring hole space, andan inlet baffle formed within the inlet ring wall and surrounding at least 180 degrees of an outer perimeter of the ring hole space;
supplying gas, received via a gas inlet hole, to an inlet plenum, wherein the inlet plenum is arranged in a first end of the inlet ring wall, the inlet plenum arranged to provide the gas to the ring hole space through the inlet baffle surrounding at least 180 degrees of the outer perimeter of the ring hole space;
conveying the gas from the inlet plenum into the ring hole space using the inlet baffle surrounding at least 180 degrees of the outer perimeter of the ring hole space;
exhausting the gas and other matter out of the ring hole space using an exhaust channel formed within a second end of the inlet ring wall and an exhaust outlet hole arranged in the second end of the inlet ring wall; and
inhibiting deposition of material evolved from the substrate during curing using the purge ring.
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Accused Products
Abstract
A purge ring for providing a gas to a wafer processing chamber includes an inlet ring wall defining a ring hole space. An outer perimeter of the inlet ring wall is elliptical. An outer perimeter of the ring hole space is circular. The inlet ring wall is a continuous structure surrounding the ring hole space. An inlet baffle formed within the inlet ring wall surrounds at least 180 degrees of the outer perimeter of the ring hole space. An inlet plenum arranged in a first end of the inlet ring wall provides the gas to the ring hole space through the inlet baffle. An exhaust channel is formed within the inlet ring wall in a second end of the inlet ring wall. An exhaust outlet hole arranged in the second end of the inlet ring wall exhausts the gas out of the ring hole space via the exhaust channel.
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Citations
10 Claims
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1. A method for removing chemical species from a substrate, comprising:
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arranging a purge ring in a chamber above (i) a pedestal and (ii) a purge space defined above the pedestal, the purge ring including an inlet ring wall defining a ring hole space above the purge space, wherein the inlet ring wall corresponds to a continuous structure surrounding the ring hole space, and an inlet baffle formed within the inlet ring wall and surrounding at least 180 degrees of an outer perimeter of the ring hole space; supplying gas, received via a gas inlet hole, to an inlet plenum, wherein the inlet plenum is arranged in a first end of the inlet ring wall, the inlet plenum arranged to provide the gas to the ring hole space through the inlet baffle surrounding at least 180 degrees of the outer perimeter of the ring hole space; conveying the gas from the inlet plenum into the ring hole space using the inlet baffle surrounding at least 180 degrees of the outer perimeter of the ring hole space; exhausting the gas and other matter out of the ring hole space using an exhaust channel formed within a second end of the inlet ring wall and an exhaust outlet hole arranged in the second end of the inlet ring wall; and inhibiting deposition of material evolved from the substrate during curing using the purge ring. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification