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Apparatus and techniques to treat substrates using directional plasma and point of use chemistry

  • US 10,128,082 B2
  • Filed: 07/24/2015
  • Issued: 11/13/2018
  • Est. Priority Date: 07/24/2015
  • Status: Active Grant
First Claim
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1. An apparatus to treat a substrate, comprising:

  • an extraction plate to extract a plasma beam from a plasma chamber and direct the plasma beam to the substrate, the plasma beam comprising ions forming a non-zero angle of incidence with respect to a perpendicular to a plane of the substrate; and

    a gas outlet system disposed outside the plasma chamber, the gas outlet system coupled to a gas source and arranged to deliver to the substrate a reactive gas received from the gas source, wherein the reactive gas does not pass through the plasma chamber, and wherein the gas outlet system comprises a channel, the channel extending along an edge of the plasma chamber.

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