Stackable molded microelectronic packages

• US 10,128,216 B2
• Filed: 12/09/2016
• Issued: 11/13/2018
• Est. Priority Date: 07/19/2010
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Haba, Belgacem
• Primary Examiner(s): TOBERGTE, NICHOLAS J
• Application Number:
  US15/374,282
• Publication Number:
  US 20170154874A1
• Time in Patent Office: 704 Days
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/1401 Structure
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06548 Conductive via connections through the substrate, container, or encapsulation
• CPC Class Codes: H01L 2225/06565 the devices having the same size and there being no auxiliary carrier between the devices
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/1023 : the support being an insulating substrate
• CPC Class Codes: H01L 2225/1047 : Details of electrical connections between containers
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/315 : the encapsulation having a cavity
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 23/49805 : the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A microelectronic package has a microelectronic element overlying or mounted to a first surface of a substrate and substantially rigid conductive posts projecting above the first surface or projecting above a second surface of the substrate remote therefrom. Conductive elements exposed at a surface of the substrate opposite the surface above which the conductive posts project are electrically interconnected with the microelectronic element. An encapsulant overlies at least a portion of the microelectronic element and the surface of the substrate above which the conductive posts project, the encapsulant having a recess or a plurality of openings each permitting at least one electrical connection to be made to at least one conductive post. At least some conductive posts are electrically insulated from one another and adapted to simultaneously carry different electric potentials. In particular embodiments, the openings in the encapsulant at least partially expose conductive masses joined to posts, fully expose top surfaces of posts and partially expose edge surfaces of posts, or may only partially expose top surfaces of posts.

Claims

1. A microelectronic package comprising:

a substrate having a first surface and a second surface remote from the first surface;

a microelectronic element overlying the first surface;

a plurality of conductors projecting above at least one of the first or second surfaces, the plurality of conductors having top surfaces remote from the substrate and edge surfaces extending away from the top surfaces;

conductive masses joined to at least the top surfaces of the plurality of conductors;

conductive elements exposed at a surface of the substrate opposite the surface above which the conductive posts project, the conductive elements being electrically interconnected with the microelectronic element; and

an encapsulant overlying at least a portion of the microelectronic element and the surface of the substrate above which the conductive posts project, the encapsulant having a plurality of openings each partially exposing at least one of the conductive masses disposed within the opening, wherein the encapsulant contacts the top surface of the conductive masses.

2. The microelectronic package as claimed in claim 1, wherein the conductive masses project to a first height above at least one of the first or second surfaces, the encapsulant having a major surface at a second height above a same surface of the substrate above which the conductive masses project, the second height being greater than the first height, wherein the openings in the encapsulant are openings in the major surface.

3. The microelectronic package as claimed in claim 1, wherein the first surface has a first region and a second region extending from the first region, the microelectronic element overlies the first region, the plurality of conductors and the conductive masses are aligned with the second region, and wherein the major surface of the encapsulant is a substantially planar surface overlying the first and second regions of the first surface at an at least substantially uniform second height therefrom and overlying the microelectronic element.

4. The microelectronic package as claimed in claim 2, wherein the plurality of conductors are a plurality of conductive posts, and wherein at least one conductive post includes a tip region remote from the microelectronic element and a second region disposed below the tip region and closer to the substrate, the second region and tip region having respective concave circumferential surfaces, and the at least one post consisting essentially of metal and having a horizontal dimension which is a first function of vertical location in the tip region and which is a second function of vertical location in the second region.

5. The microelectronic package as claimed in claim 1, wherein the conductive elements include at least one of conductive posts or masses of conductive bonding material, and a portion of the encapsulant overlies the second surface and further has a plurality of second openings, each partially exposing at least one of the conductive elements, wherein at least some of the conductive elements are electrically insulated from one another and adapted to simultaneously carry different electric potentials.

6. The microelectronic package of claim 1, wherein the conductive masses comprise a solder.

7. The microelectronic package as claimed in claim 1, wherein the conductive masses further comprises a top surface that is substantially planar and wherein at least some of the openings are tapered.

8. The microelectronic package of claim 1, wherein at least one of the first or second surfaces has a first region and a second region extending from the first region, the microelectronic element overlies the first region, and the conductive elements are aligned with the second region and project to a first height above the second region, the encapsulant contacts the conductive masses and has a major surface above the second region at a second height above the second region, the second height being greater than the first height, wherein the openings in the encapsulant are openings in the major surface.

9. The microelectronic package of claim 4, wherein the major surface of the encapsulant is a substantially planar surface.

10. The microelectronic package of claim 9, wherein the substantially planar surface overlies the first and second regions of the second surface at an at least substantially uniform second height therefrom and overlying the microelectronic element.

11. A microelectronic package comprising:

a substrate having a first surface and a second surface remote from the first surface;

a microelectronic element overlying the first surface;

a plurality of conductive masses projecting from at least one of the first or second surfaces and electrically interconnected with the microelectronic element, each of the plurality of conductive masses having an exposed top surface remote from the substrate; and

an encapsulant overlying at least a portion of the microelectronic element and a surface of the substrate above which the plurality of conductive metal masses project, the encapsulant having a plurality of openings at least partially exposing the exposed top surfaces of the plurality of conductive masses, the exposed top surfaces of the plurality of conductive masses being spaced apart from an outer surface of the encapsulant.

12. The microelectronic package of claim 11, wherein an interior edge of the encapsulant contacts the plurality of conductive masses, and wherein the conductive masses are comprised of solder.

13. The microelectronic package of claim 11, further comprising conductive elements extending upwards from a same surface from which the plurality of conductive masses project, the conductive masses contacting the conductive elements.

14. The microelectronic package of claim 13, wherein conductive elements exposed at and projecting away from an opposed surface of the substrate opposite the surface above which the plurality of conductive masses project, the conductive elements having top surfaces remote from the opposed surface of the substrate, the conductive elements being electrically interconnected with the microelectronic element and the plurality of conductive masses.

15. The microelectronic package of claim 11, wherein at least some of the plurality of openings are tapered.

16. The microelectronic package of claim 11, wherein at least one of the first or second surfaces has a first region and a second region extending from the first region, the microelectronic element overlies the first region, and the plurality of conductive masses are aligned with the second region and project to a first height above the second region, the encapsulant contacts the plurality of conductive masses and has a major surface above the second region at a second height above the second region, the second height being greater than the first height, wherein each of the openings in the encapsulant is an opening in the major surface.

17. The microelectronic package of claim 16, wherein the major surface of the encapsulant is a substantially planar surface.

18. The microelectronic package of claim 17, wherein the substantially planar surface of the encapsulant overlies the first and second regions of the first surface at an at least substantially uniform second height therefrom and overlying the microelectronic element.

19. The microelectronic package of claim 11, wherein at least some of the plurality of conductive masses are electrically insulated from one another and adapted to simultaneously carry different electric potentials.

20. The microelectronic package as claimed in claim 14, wherein surfaces of at least two of the plurality of conductive masses are at least partially exposed within a single one of the plurality of openings.