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Light emitting diode chip having distributed bragg reflector and method of fabricating the same

  • US 10,128,306 B2
  • Filed: 01/09/2017
  • Issued: 11/13/2018
  • Est. Priority Date: 11/13/2009
  • Status: Active Grant
First Claim
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1. A light-emitting diode package, comprising:

  • leads;

    a package body comprising a mounting surface; and

    a light emitting diode chip disposed on the mounting surface and connected to the leads, the light emitting diode chip comprising;

    a substrate; and

    a plurality of light emitting cells disposed on an upper surface of the substrate and positioned to be spaced apart from each other, each of the plurality of light emitting cells comprising an active layer disposed between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer;

    a phosphor member disposed on the light-emitting diode chip; and

    a distributed Bragg reflector disposed on a lower surface of the substrate and disposed between the plurality of light emitting cells,wherein the lower surface of the substrate has a root-mean-square (RMS) value of 3 nm or less.

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