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Method and apparatus for delivering power to semiconductors

  • US 10,128,764 B1
  • Filed: 04/05/2016
  • Issued: 11/13/2018
  • Est. Priority Date: 08/10/2015
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a planar magnetic structure including a multilayer printed circuit board (PCB) having a first external surface, a second external surface, and conductive features arranged on conductive layers of the PCB to form one or more windings around one or more predetermined axes;

    a hole in the PCB at each of the one or more predetermined axes, each hole having an inner edge aligned with an inner circumference of one of the windings;

    a first magnetically permeable core section affixed to the first external surface of the PCB covering a selected hole or selected holes;

    a second magnetically permeable core section affixed to the second external surface of the PCB covering the selected hole or selected holes;

    a magnetically permeable fluid disposed in the selected hole or selected holes, wherein the effective magnetic permeability of the magnetically permeable fluid is 10 or greater; and

    wherein the magnetically permeable fluid is contained within the selected hole or selected holes.

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