Multi-axis integrated MEMS inertial sensing device on single packaged chip
First Claim
1. A multi-axis integrated MEMS inertial sensing device, the device comprising:
- a substrate member having a surface region, the surface region has an inner portion and an outer portion, the outer portion completely surrounding the inner portion;
at least one bond pad overlying each of four corners of the outer portion of the surface region;
a first MEMS inertial sensor overlying the inner portion of the surface region, the first MEMS inertial sensor comprising an accelerometer, the accelerometer being disposed completely inside the inner portion of the surface region; and
a second MEMS inertial sensor overlying the outer portion of the surface region;
wherein the second MEMS inertial sensor comprises a 3-axis gyroscope which includes one or more pairs of one-axis gyroscope sensors, the two one-axis gyroscope sensors of each pair being configured to sense along one common direction in space and being located symmetrically at opposite sides of the accelerometer, the gyroscope being disposed completely inside the outer portion of the surface region;
wherein the 3-axis gyroscope comprises x-axis gyroscope sensors, y-axis gyroscope sensors, and z-axis gyroscope sensors;
wherein the x-axis gyroscope sensors are placed along one axis of the substrate, and y-axis gyroscope sensors and the z-axis gyroscope sensors are placed along an orthogonal axis of the substrate;
wherein the multi-axis integrated MEMS inertial sensing device further comprises a cap wafer having a Z-travel stop structure spatially configured overlying the inner portion, thereby allowing high damping to the accelerometer and low damping to the 3-axis gyroscope.
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Abstract
A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially configured with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor'"'"'s temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.
43 Citations
16 Claims
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1. A multi-axis integrated MEMS inertial sensing device, the device comprising:
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a substrate member having a surface region, the surface region has an inner portion and an outer portion, the outer portion completely surrounding the inner portion; at least one bond pad overlying each of four corners of the outer portion of the surface region; a first MEMS inertial sensor overlying the inner portion of the surface region, the first MEMS inertial sensor comprising an accelerometer, the accelerometer being disposed completely inside the inner portion of the surface region; and a second MEMS inertial sensor overlying the outer portion of the surface region; wherein the second MEMS inertial sensor comprises a 3-axis gyroscope which includes one or more pairs of one-axis gyroscope sensors, the two one-axis gyroscope sensors of each pair being configured to sense along one common direction in space and being located symmetrically at opposite sides of the accelerometer, the gyroscope being disposed completely inside the outer portion of the surface region; wherein the 3-axis gyroscope comprises x-axis gyroscope sensors, y-axis gyroscope sensors, and z-axis gyroscope sensors; wherein the x-axis gyroscope sensors are placed along one axis of the substrate, and y-axis gyroscope sensors and the z-axis gyroscope sensors are placed along an orthogonal axis of the substrate; wherein the multi-axis integrated MEMS inertial sensing device further comprises a cap wafer having a Z-travel stop structure spatially configured overlying the inner portion, thereby allowing high damping to the accelerometer and low damping to the 3-axis gyroscope. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated MEMS device comprises:
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a semiconductor substrate comprising a central region and a border region completely surrounding the central region; a three-axis accelerometer formed only within the central region of the semiconductor substrate; and a three-axis gyroscope formed only within the border region of the semiconductor substrate, wherein the three-axis accelerometer is surrounded by portions of the three-axis gyroscope along both an X-axis and a Y-axis of the substrate; wherein the three-axis gyroscope comprises x-axis gyroscope sensors, y-axis gyroscope sensors, and z-axis gyroscope sensors; wherein the x-axis gyroscope sensors are placed along one axis of the substrate, and y-axis gyroscope sensors and the z-axis gyroscope sensors are placed along an orthogonal axis of the substrate; wherein each x-axis gyroscope sensor comprises a proof mass, a displacement driver, and an anchor structure, where the displacement driver and the anchor structure are disposed inside the proof mass; wherein the integrated MEMS device further comprises a cap wafer having a Z-travel stop structure spatially configured overlying the central region, thereby allowing high damping to the three-axis accelerometer and low damping to the three-axis gyroscope. - View Dependent Claims (9, 10, 11, 12)
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13. A multi-axis integrated MEMS inertial sensing device, the device comprising:
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a semiconductor substrate comprising a central region and a border region around the central region; at least one bond pad overlying each of the corners of the border region; a three-axis accelerometer overlying the central region; a three-axis gyroscope overlying the border region, wherein the three-axis gyroscope comprises a pair of gyroscope sensors for each of X, Y, and Z axes, the two gyroscope sensors of each pair being located symmetrically at opposite sides of the three-axis accelerometer, wherein the pair of gyroscope sensors for the X axis are placed along one axis of the substrate, and the pair of gyroscope sensors for the Y axis and the pair of gyroscope sensors for the Z axis are placed along an orthogonal axis of the substrate; and a cap wafer having a Z-travel stop structure, the Z-travel stop structure spatially configured overlying the central region, thereby allowing high damping to the three-axis accelerometer and low damping to the three-axis gyroscope; wherein each of the gyroscope sensors for the X, Y, and Z axes comprises a proof mass, a displacement driver, and an anchor structure, where the displacement driver and the anchor structure are disposed inside the proof mass. - View Dependent Claims (14, 15, 16)
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Specification