Micro hermetic sensor

• US 10,132,712 B1
• Filed: 09/14/2016
• Issued: 11/20/2018
• Est. Priority Date: 09/14/2016
• Status: Active Grant

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Inventors: Zhang, Chunbo, Nguyen, Phuong, Zeng, Xianglin, Tenorio, Maria L.
• Primary Examiner(s): Verbitsky, Gail Kaplan
• Application Number:
  US15/265,135
• Time in Patent Office: 797 Days
• CPC Class Codes: G01M 3/002 by using thermal means
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A sensor assembly for determining whether a hermetically sealed cavity between opposing substrate wafers in a wafer level packaged (WLP) chip is leaking. The sensor assembly includes a thermal insulating layer provided within the cavity, and a heater and temperature sensor deposited on the insulation layer. The thermal insulating layer is made of a suitable dielectric that is compatible with WLP and MMIC fabrication processes and can be, for example, benzocyclobutene (BCB) or polyimide. The sensor is responsive to a current that heats the thermal insulation layer so that heat dissipated by the thermal insulation layer is drawn away by gas between the layer and the substrate that determines the temperature of the sensor, which is detected.

Claims

1. A sensor assembly for determining whether a hermetically sealed cavity between opposing substrate wafers in a wafer level packaged (WLP) chip is leaking, said sensor assembly comprising:

a membrane secured to a surface of one of the wafers within the cavity so as to define a gas gap between the membrane and the one wafer; and

a resistive element deposited on the membrane, said resistive element being responsive to a current that heats the membrane so that heat dissipated by the membrane is drawn away by gas within the cavity that determines the temperature of the resistive element, which is detected.

2. The sensor assembly according to claim 1 wherein the membrane is a benzocyclobutene (BCB) membrane.

3. The sensor assembly according to claim 1 where the membrane is a polyimide membrane.

4. The sensor assembly according to claim 1 wherein the membrane is circular.

5. The sensor assembly according to claim 1 wherein the membrane includes openings on at least two sides to allow for membrane release during fabrication of the assembly.

6. The sensor assembly according to claim 1 wherein the resistive element is a nichrome or platinum element.

7. The sensor assembly according to claim 1 wherein the resistive element has a spiral configuration.

8. The sensor assembly according to claim 1 wherein the substrate wafers are GaAs, InP or SiC wafers.

9. The sensor assembly according to claim 1 wherein the gas gap has a thickness of about 5000 Å

or less.

10. The sensor assembly according to claim 1 wherein the WLP chip hermetically seals a monolithic microwave integrated circuit (MMIC).

11. The sensor assembly according to claim 1 wherein the resistive element is a heater and temperature sensor.

12. A sensor assembly for determining whether a hermetically sealed cavity between opposing substrate wafers in a wafer level package (WLP) chip is leaking, said sensor assembly comprising:

a thermal insulation layer deposited on a surface of one of the wafers within the cavity;

an air bridge formed to the insulation layer and defining a gap therebetween; and

a resistive element formed on the insulation layer, said resistive element being responsive to a current that heats the thermal insulation layer so that heat drawn away by gas within the gap determines the temperature of the resistive element, which is detected.

13. The sensor assembly according to claim 12 wherein the thermal insulation layer is a benzocyclobutene (BCB) thermal insulating layer.

14. The sensor assembly according to claim 12 where the thermal insulation layer is a polyimide thermal insulating layer.

15. The sensor assembly according to claim 12 wherein the resistive element is a nichrome or platinum element.

16. The sensor assembly according to claim 12 wherein the resistive element has a spiral configuration.

17. The sensor assembly according to claim 12 wherein the resistive element is a heater and temperature sensor.

18. A sensor assembly for determining whether a hermetically sealed cavity between opposing substrate wafers and a wafer level packaged (WLP) chip is leaking, said sensor assembly comprising:

a thermal insulating layer provided within the cavity; and

a heater and temperature sensor deposited on the insulation layer, said sensor being responsive to a current that heats the thermal insulation layer so that heat dissipated by the thermal insulation layer is drawn away by gas within the cavity that determines the temperature of the sensor, which is detected.

19. The sensor assembly according to claim 18 wherein the thermal insulating layer is a benzocyclobutene (BCB) thermal insulating layer or a polyimide thermal insulating layer.

20. The sensor assembly according to claim 18 wherein the sensor has a spiral configuration.