Force sensing in an electronic device using a single layer of strain-sensitive structures

• US 10,133,418 B2
• Filed: 09/07/2016
• Issued: 11/20/2018
• Est. Priority Date: 09/07/2016
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Smith, John Stephen
• Primary Examiner(s): Lin, Chun-Nan
• Application Number:
  US15/258,810
• Publication Number:
  US 20180067612A1
• Time in Patent Office: 804 Days
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04105 Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04144 using an array of force sensing means position sensing using the local deformation of sensor cells G06F3/0447
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

A strain-sensitive structure includes two resistive structures connected in series and formed on one surface of a substrate. One resistive structure is formed with a first trace arranged in first trace pattern. The other resistive structure is formed with a second trace arranged in a second trace pattern. The first resistive structure is configured to experience strain in response to an applied stress on the substrate. The second resistive structure is configured to experience less strain in response to the applied stress on the substrate compared to the first resistive structure. Together the strain-sensitive structure and the substrate form a force sensing layer that can be included in an electronic device.

Claims

1. An electronic device, comprising:

a display layer positioned below a cover layer;

a force sensing layer positioned adjacent the display layer, the force sensing layer comprising;

a substrate; and

a plurality of strain-sensitive structures formed on a surface of the substrate;

a processing device operably connected to the plurality of strain-sensitive structures and configured to;

receive a strain signal from each strain-sensitive structure; and

correlate at least one strain signal into an amount of force applied to the cover layer,

wherein each strain-sensitive structure in the plurality of strain-sensitive structures comprises;

a first trace arranged in a first trace pattern on the surface of the substrate and forming a first resistive structure;

a second trace arranged in a second trace pattern on the surface of the substrate and forming a second resistive structure, the second resistive structure connected in series with the first resistive structure, wherein

the first trace pattern of the first resistive structure is sensitive to strain in one or more directions in response to an applied stress on the substrate,

the second trace pattern of the second resistive structure is less sensitive to strain than the first trace pattern of the first resistive structure in response to the applied stress on the substrate; and

in response to the applied stress on the substrate, a first resistance value of the first resistive structure changes more compared to a second resistance value of the second resistive structure.

2. The electronic device of claim 1, wherein:

a drive signal line is received at a first node of one strain-sensitive structure; and

the drive signal line is shared with an adjacent strain-sensitive structure and is received at a different second node of the adjacent strain-sensitive structure.

3. The electronic device of claim 1, wherein the substrate is attached to a bottom surface of the display layer.

4. The electronic device of claim 1, wherein:

a first terminal of the first resistive structure is connected to a first drive signal line;

a second terminal of the second resistive structure is connected to a second drive signal line; and

a common terminal of the first and the second resistive structures is connected to a strain signal line.

5. The electronic device of claim 1, wherein the first trace comprises a first section that includes a first set of legs arranged in a serpentine pattern, each leg in the first set of legs having a first length.

6. The electronic device of claim 5, wherein the second trace comprises a second section that includes a second set of legs arranged in the serpentine pattern, each leg in the second set of legs having a second length that is shorter than the first length.

7. The electronic device of claim 6, wherein:

one end of the first resistive structure is connected to a first drive signal line and another end of the first resistive structure is connected to a strain signal line; and

one end of the second resistive structure is connected to a second drive signal line and another end of the second resistive structure is connected to the strain signal line.

8. The electronic device of claim 1, wherein the first and the second traces comprise a metal or metal alloy formed in or on a plastic substrate.

9. The electronic device of claim 1, wherein the first trace pattern and the second trace pattern are arranged on the surface of the substrate to reduce magnetic interference.

10. The electronic device of claim 1, further comprising at least one cavity formed in the substrate adjacent at least a portion of the second trace.

11. The electronic device of claim 1, wherein:

the first trace comprises;

a first section comprising a first set of legs arranged in a serpentine pattern, the first set of legs having a first length extending along a first axis;

a second section comprising a second set of legs arranged in the serpentine pattern, the second set of legs having the first length extending along the first axis; and

a third section including a leg extending along a second axis and connecting the first section to the second section; and

the second trace comprises;

a fourth section positioned adjacent three sides of the first section, the fourth section comprising a third set of legs arranged in the serpentine pattern, the third set of legs having a second length that is less than the first length; and

a fifth section connected to the fourth section, the fifth section positioned adjacent three sides of the second section, the fifth section comprising a fourth set of legs arranged in the serpentine pattern, the fourth set of legs having the second length.

12. The electronic device of claim 11, wherein the second trace further comprises a sixth section positioned adjacent, and connected to, the fifth section, the sixth section comprising a fifth set of legs arranged in the serpentine pattern, the fifth set of legs having the second length extending along the second axis.

13. The electronic device of claim 11, wherein the first trace pattern and the second trace pattern are duplicated and rotated at least once on the substrate.

14. The electronic device of claim 13, wherein the first and the third sections of the first trace are arranged to detect strain along the first axis and a rotated first section and a rotated third section of the first trace are arranged to detect strain along the second axis.

15. The electronic device of claim 11, wherein the second axis is normal to the first axis.

16. The electronic device of claim 11, wherein the fourth and the fifth sections each experience less strain in response to the applied stress on the substrate compared to the first and the second sections.

17. The electronic device of claim 11, further comprising at least one cavity formed in the substrate adjacent at least a portion of the second trace.

18. The electronic device of claim 11, further comprising trenches formed in the substrate between and around each leg in the first, the second, and the third sections of the first trace and between and around each leg in the fourth and the fifth sections of the second trace.

19. The electronic device of claim 18, further comprising an insulating layer disposed between the substrate and the first and second traces.