Cobalt top layer advanced metallization for interconnects
First Claim
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1. An integrated circuit device comprising:
- a substrate including a dielectric layer patterned with a pattern includes a set of features in the dielectric layer for a set of metal conductor structures;
an adhesion promoting layer disposed on the set of features in the patterned dielectric layer;
a metal layer filling a first portion of the set of features disposed on the adhesion promoting layer;
a ruthenium layer disposed on the metal layer, wherein the ruthenium layer comprises a nitrogen enriched surface layer; and
a cobalt layer disposed on the ruthenium layer filling a second portion of the set of features, the second portion a remainder portion of the set of features not filled by the adhesion promoting layer, the metal layer and the ruthenium layer, wherein the cobalt layer is completely formed using a physical vapor deposition process.
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Abstract
An advanced metal conductor structure is described. An integrated circuit device including a substrate having a patterned dielectric layer. The pattern includes a set of features in the dielectric for a set of metal conductor structures. An adhesion promoting layer is disposed over the set of features in the patterned dielectric. A metal layer fills a first portion of the set of features and is disposed over the adhesion promoting layer. A ruthenium layer is disposed over the metal layer. A cobalt layer is disposed over the ruthenium layer fills a second portion of the set of features. The cobalt layer is formed using a physical vapor deposition process.
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Citations
10 Claims
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1. An integrated circuit device comprising:
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a substrate including a dielectric layer patterned with a pattern includes a set of features in the dielectric layer for a set of metal conductor structures; an adhesion promoting layer disposed on the set of features in the patterned dielectric layer; a metal layer filling a first portion of the set of features disposed on the adhesion promoting layer; a ruthenium layer disposed on the metal layer, wherein the ruthenium layer comprises a nitrogen enriched surface layer; and a cobalt layer disposed on the ruthenium layer filling a second portion of the set of features, the second portion a remainder portion of the set of features not filled by the adhesion promoting layer, the metal layer and the ruthenium layer, wherein the cobalt layer is completely formed using a physical vapor deposition process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification