Submount based surface mount device (SMD) light emitter components and methods
First Claim
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1. A method of providing a surface mount device (SMD) light emitter component, the method comprising:
- providing a ceramic based submount, wherein the submount comprises a single body of material that is devoid of electrical conductors;
providing at least one electrical contact that physically contacts at least one external surface of the submount;
providing at least one light emitter chip on the submount; and
dispensing a volume of material over at least one side of the at least one electrical contact to form a non-metallic retention material disposed about a perimeter of the submount and defining a reflector cavity directly on a portion of the submount;
dispensing a filling material in the reflector cavity and over the at least one light emitter chip,wherein;
the retention material is a dispensed material comprising a silicone material, an epoxy, a plastic material, or a thermoset material;
the retention material is adapted to receive and contact the filling material;
the retention material has at least one curved upper edge, which is contiguous with an upper surface of the filling material;
the retention material is a different material than the ceramic based submount; and
the retention material is thicker than the at least one light emitter chip for retaining the filling material over the at least one light emitter chip; and
curing the retention material and the filling material.
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Abstract
Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In one aspect, a method of providing a submount based light emitter component can include providing a ceramic based submount, providing at least one light emitter chip on the submount, providing at least one electrical contact on a portion of the submount, and providing a non-ceramic based reflector cavity on a portion of the submount.
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Citations
28 Claims
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1. A method of providing a surface mount device (SMD) light emitter component, the method comprising:
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providing a ceramic based submount, wherein the submount comprises a single body of material that is devoid of electrical conductors; providing at least one electrical contact that physically contacts at least one external surface of the submount; providing at least one light emitter chip on the submount; and dispensing a volume of material over at least one side of the at least one electrical contact to form a non-metallic retention material disposed about a perimeter of the submount and defining a reflector cavity directly on a portion of the submount; dispensing a filling material in the reflector cavity and over the at least one light emitter chip, wherein; the retention material is a dispensed material comprising a silicone material, an epoxy, a plastic material, or a thermoset material; the retention material is adapted to receive and contact the filling material; the retention material has at least one curved upper edge, which is contiguous with an upper surface of the filling material; the retention material is a different material than the ceramic based submount; and the retention material is thicker than the at least one light emitter chip for retaining the filling material over the at least one light emitter chip; and
curing the retention material and the filling material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A surface mount device (SMD) submount based light emitter component comprising:
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a ceramic based submount, the submount comprising a single, monolithic body of material which is devoid of internal electrical conductors; at least one electrical contact disposed along portions of at least three external surfaces of the submount; at least one light emitter chip disposed on the submount; and a non-metallic retention material defining a reflector cavity disposed about the at least one light emitter chip, wherein the retention material is dispensed as a liquid over at least one side of the at least one electrical contact and is disposed about a perimeter of the submount; and a filling material disposed in the reflector cavity and over the at least one light emitter chip, wherein; the retention material comprises a dispensed material, comprising a silicone material, an epoxy, a plastic material, or a thermoset material; the retention material is adapted to receive and contact the filling material; the retention material has at least one curved edge which is contiguous with the filling material; the retention material comprises a wall that is disposed around the at least one light emitter chip, wherein the wall comprises an upper edge with a curved sectional shape that is contiguous with an upper surface of the filling material; the retention material is a different material than the ceramic based submount; and the retention material is thicker than the light emitter chip for retaining the filling material over the light emitter chip. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. A surface mount device (SMD) light emitter component comprising:
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a submount comprising a single, monolithic layer of material, the submount being devoid of internal electrical conductors; at least one electrical contact spaced apart from the at least one light emitter chip, the electrical contact comprising a top contact portion, a bottom contact portion, and a side contact portion disposed between the top contact and the bottom contact portion, wherein the top, bottom, and side contact portions are only disposed on, and in physical contact with, external portions of the submount; and the at least one light emitter chip disposed over the submount and wirebonded to the top contact portion a non-metallic retention material defining a reflector cavity disposed directly on a portion of the submount, wherein the retention material is dispensed as a liquid over the top contact portion of the at least one electrical contact and is disposed about a perimeter of the submount; and a filling material disposed in the reflector cavity and over the at least one light emitter chip, wherein; the retention material comprises a dispensed material, comprising a silicone material, an epoxy, a plastic material, or a thermoset material; the retention material is adapted to receive, retain and contact the filling material; the retention material comprises a wall that is disposed around the at least one light emitter chip, wherein the wall comprises an upper edge having a curved sectional shape, the upper edge being contiguous with the filling material; and the retention material is a different material than the submount. - View Dependent Claims (24, 25, 26, 27, 28)
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Specification