Quantum dot LED package structure
First Claim
1. A quantum dot LED package structure, comprising a bottom bracket, an external bracket, a quantum dot layer light emitting chip, an inorganic barrier layer and a top silica gel layer;
- the quantum dot layer light emitting chip being provided on the bottom bracket;
the external bracket being provided on the bottom bracket and surrounding the quantum dot layer light emitting chip;
the inorganic barrier layer covering the external bracket and the quantum dot layer light emitting chip on the bottom bracket to package the external bracket and the quantum dot layer light emitting chip;
the top silica gel layer being provided on the inorganic barrier layer.
1 Assignment
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Accused Products
Abstract
Provided is a quantum dot LED package structure comprising a bottom bracket, an external bracket, a quantum dot layer light emitting chip, an inorganic barrier layer and a top silica gel layer, wherein the inorganic barrier layer covers the external bracket and the quantum dot layer light emitting chip on the bottom bracket to package the external bracket and the quantum dot layer light emitting chip; the external bracket and the quantum dot layer light emitting chip are packaged by using the inorganic barrier layer, and a top silica gel layer is provided on the inorganic barrier layer, and the water and oxygen barrier condition that the existing package structure simply using the silica gel layer cannot meet can be satisfied and good heat dissipation can be provided. Thus, the issues of mass production difficulty, high cost, low luminous efficiency, difficulty to achieve narrow border application can be solved.
8 Citations
18 Claims
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1. A quantum dot LED package structure, comprising a bottom bracket, an external bracket, a quantum dot layer light emitting chip, an inorganic barrier layer and a top silica gel layer;
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the quantum dot layer light emitting chip being provided on the bottom bracket; the external bracket being provided on the bottom bracket and surrounding the quantum dot layer light emitting chip; the inorganic barrier layer covering the external bracket and the quantum dot layer light emitting chip on the bottom bracket to package the external bracket and the quantum dot layer light emitting chip; the top silica gel layer being provided on the inorganic barrier layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A quantum dot LED package structure, comprising a bottom bracket, an external bracket, a quantum dot layer light emitting chip, an inorganic barrier layer and a top silica gel layer;
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the quantum dot layer light emitting chip being provided on the bottom bracket; the external bracket being provided on the bottom bracket and surrounding the quantum dot layer light emitting chip; the inorganic barrier layer covering the external bracket and the quantum dot layer light emitting chip on the bottom bracket to package the external bracket and the quantum dot layer light emitting chip; the top silica gel layer being provided on the inorganic barrier layer; wherein the inorganic barrier layer is formed by a low temperature sputtering method, a plasma enhanced chemical vapor deposition method or a thermal evaporation method; wherein the quantum dot layer light emitting chip comprises a blue light emitting chip, a first insulation layer, a quantum dot layer, and a second insulation layer, which are provided on the bottom bracket from bottom to top in order. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification