Qubit and coupler circuit structures and coupling techniques
First Claim
Patent Images
1. A cryogenic quantum bit package comprising:
- (a) one or more quantum bit (qubit) integrated circuits, each of said one or more qubit integrated circuits comprising at least two qubit circuits;
(b) a quantum bit bias control line;
(c) a coupler circuit disposed to couple signals between said at least two qubit circuits;
(d) a superconducting multi-chip module (MCM); and
(e) one or more superconducting and/or nearly superconducting interconnects, each of said one or more superconducting interconnects disposed between and electrically coupled to said one or more quantum bit integrated circuits and said superconducting MCM such that a signal path is provided between said one or more qubit integrated circuits and said MCM.
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Abstract
A cryogenic quantum bit package with multiple qubit circuits facilitates inter-qubit signal propagation using a multi-chip module (MCM). Multiple qubits are grouped within the package into one or more qubit integrated circuits (ICs). The qubit ICs themselves are electrically coupled to each other via a structure including a superconducting MCM and superconducting interconnects. Coupling of quantum electrical signals between a qubit and other qubits, a substrate, or the MCM uses a coupler circuit, such as a Josephson junction, capacitor, inductor, or resonator.
126 Citations
21 Claims
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1. A cryogenic quantum bit package comprising:
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(a) one or more quantum bit (qubit) integrated circuits, each of said one or more qubit integrated circuits comprising at least two qubit circuits; (b) a quantum bit bias control line; (c) a coupler circuit disposed to couple signals between said at least two qubit circuits; (d) a superconducting multi-chip module (MCM); and (e) one or more superconducting and/or nearly superconducting interconnects, each of said one or more superconducting interconnects disposed between and electrically coupled to said one or more quantum bit integrated circuits and said superconducting MCM such that a signal path is provided between said one or more qubit integrated circuits and said MCM. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A cryogenic quantum bit package comprising:
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a first quantum bit (qubit) integrated circuit; a second quantum bit integrated circuit; a superconducting multi-chip-module (MCM); an interposer disposed between said first and second quantum bit integrated circuits and said superconducting MCM, said interposer comprising a TSV substrate and disposed to electrically interconnect said first and second quantum bit integrated circuits to said superconducting MCM. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification