Method for treating a semiconductor device
First Claim
1. A method of treating a sensor array, the sensor array including a plurality of sensors and an isolation structure, a sensor of the plurality of sensors having a sensor pad exposed at a surface of the sensor array, wherein the exposed surface of the sensor pad defines a bottom surface of the isolation structure, the method comprising:
- exposing the exposed surface of the sensor pad to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier;
applying an acid solution including an organic acid and a second non-aqueous carrier to the exposed surface of the sensor pad; and
rinsing the acid solution from the exposed surface of the sensor pad.
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Accused Products
Abstract
A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.
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Citations
18 Claims
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1. A method of treating a sensor array, the sensor array including a plurality of sensors and an isolation structure, a sensor of the plurality of sensors having a sensor pad exposed at a surface of the sensor array, wherein the exposed surface of the sensor pad defines a bottom surface of the isolation structure, the method comprising:
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exposing the exposed surface of the sensor pad to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the exposed surface of the sensor pad; and rinsing the acid solution from the exposed surface of the sensor pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification