Cu ball, Cu core ball, solder joint, solder paste, and solder foam
First Claim
1. A Cu ball containing:
- purity which is equal to or higher than 99.9% and equal to or lower than 99.995%,sphericity which is equal to or higher than 0.95, andVickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV,wherein a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a content of at least one of Pb and Bi is more than 1 ppm, and an alpha dose is equal to or less than 0.0200 cph/cm2.
1 Assignment
0 Petitions
Accused Products
Abstract
Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the Cu ball 20. The Cu ball 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV.
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Citations
16 Claims
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1. A Cu ball containing:
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purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.95, and Vickers hardness which is equal to or higher than 20 HV and equal to or less than 60 HV, wherein a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a content of at least one of Pb and Bi is more than 1 ppm, and an alpha dose is equal to or less than 0.0200 cph/cm2. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification