MEMS sensor and a semiconductor package

• US 10,137,851 B2
• Filed: 11/23/2015
• Issued: 11/27/2018
• Est. Priority Date: 12/01/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: LIUKKU, Matti, RYTKONEN, Ville-Pekka
• Primary Examiner(s): Patel, Harshad R
• Assistant Examiner(s): Roy, Punam
• Application Number:
  US14/948,503
• Publication Number:
  US 20160152202A1
• Time in Patent Office: 1,100 Days
• CPC Class Codes: B60R 2021/01286 Electronic control units
• CPC Class Codes: B60R 21/01 Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents electrical circuits for transmission of signals between steering wheel and the vehicle itself B60R16/027; for electrically actuating belt retractor locking means B60R22/343
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/033 Comb drives
• CPC Class Codes: B81B 2203/0154 Torsion bars
• CPC Class Codes: B81B 2203/0163 Spring holders
• CPC Class Codes: B81B 2207/015 the micromechanical device and the control or processing electronics being integrated on the same substrate
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/13 by measuring the force required to restore a proofmass subjected to inertial forces to a null position
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0817 for pivoting movement of the mass, e.g. in-plane pendulum

Abstract

The MEMS sensor of the invention has movable and fixed components for measuring acceleration in a rotational mode in a direction in-plane perpendicular to spring axis. The components include an element frame, a substrate, a proof-mass a spring connected to the proof-mass and to the substrate, and comb electrodes. The MEMS sensor is mainly characterized by an arrangement of the components causing an inherent sensitivity for measuring accelerations in a range covering longitudinal and transversal accelerations. One or more of the components are tilted compared to the element frame. The semiconductor package of the invention comprises at least one MEMS sensor.

Claims

1. A MEMS sensor for measuring acceleration, said MEMS sensor comprising:

a substrate;

an element frame;

a spring anchor;

a proof-mass; and

a spring,

wherein the element frame and the spring anchor are rigidly fixed to the substrate,

wherein one end of the spring is connected to the proof-mass and an opposite end of the spring is connected to the spring anchor,

wherein in a non-flexed state of the spring, a spring axis extends between the opposite ends of the spring,

wherein the proof-mass and the spring extend along a common plane, whereby the spring suspends the proof-mass to a rotary mode of motion in the common plane,

wherein the element frame comprises a rectangular form such that in the common plane, an outer surface of the element frame has four sides, of which two longitudinal sides run in parallel in a longitudinal direction, and two transversal sides run in parallel in a transversal direction, wherein the transversal direction is perpendicular to the longitudinal direction,

wherein the rectangular form of the element frame includes a first longitudinal side and a first transversal side, connected by a first vertex that is closest to the spring anchor, and

wherein the spring axis forms an acute angle with the first longitudinal side and with the first transversal side, the spring is flexural and bends when subjected to forces in the in-plane direction perpendicular to the spring axis, and the spring is rigid when subjected to forces in any other direction, thereby causing an inherent sensitivity for measuring accelerations in a range covering accelerations in the longitudinal direction and in the transversal direction,

and wherein the sensor further comprises one or more comb capacitors configured to measure the accelerations, wherein each comb capacitor includes a set of rotor comb fingers coupled to move with the proof-mass and a set of stator comb fingers rigidly fixed to the substrate.

2. The MEMS sensor of claim 1, wherein the spring axis forms an acute 45°

angle with the first longitudinal side and with the first transversal side of the element frame.

3. The MEMS sensor of claim 1, wherein the spring comprises a beam, or a meandering spring.

4. The MEMS sensor of claim 1, wherein at least part of a side surface of the proof-mass runs closer to the first vertex than a point of connection of the spring to the proof-mass.

5. The MEMS sensor of claim 4, wherein the proof-mass includes a cut-out within which the spring extends to the point of connection.

6. The MEMS sensor of claim 5, wherein the proof-mass comprises a polygon form in which two adjacent side segments form a right angle, one of the adjacent side segments being parallel to the longitudinal direction, and the other one of the adjacent side segments being parallel to the transversal direction, and a corner vertex between the adjacent side segments is closest to a second vertex, wherein the second vertex is opposite to the first vertex in the rectangular form of the element frame.

7. The MEMS sensor of claim 1, wherein each rotor comb finger of the set of rotor comb fingers forms a parallel plate capacitor with a stator comb finger of the set of stator comb fingers adjacent to it.

8. The MEMS sensor of claim 7, wherein in the non-flexed state of the spring, the parallel plate capacitors of the one or more comb capacitors have the same area of overlap.

9. The MEMS sensor of claim 7, wherein each stator comb finger of the set of stator comb fingers is of the same length.

10. The MEMS sensor of claim 9, wherein

the proof-mass comprises a polygon form and each set of rotor comb fingers extends towards the stator comb fingers from at least three side segments of the proof-mass;

and

the stator bars comprise a polygon form that matches with the side segments of the proof-mass such that the parallel plate capacitors of the one or more comb capacitors have the same area of overlap, wherein the stator comb fingers are of the equal length.

11. The MEMS sensor of claim 7, wherein the first set of stator comb fingers are connected to a first rigid stator bar and the second set of stator comb fingers are connected to a second rigid stator bar, wherein stator bars are anchored to the substrate.

12. The MEMS sensor of claim 11, wherein the stator bars are anchored to the substrate with stator anchors, and the distance from the stator anchors to the spring anchor is less than half of the smaller of the first longitudinal side and the first transversal side.

13. The MEMS sensor of claim 1, further comprising a pair of comb capacitors comprising a first comb capacitor with first rotor comb fingers and first stator comb fingers and a second comb capacitor with second rotor comb fingers and second stator comb fingers, the pair of comb capacitors being configured for differential detection.

14. The MEMS sensor of claim 1, wherein the stator comb fingers form a first acute angle with the first longitudinal side and with the first transversal side of the element frame, and the rotor comb fingers form a second acute angle with the first longitudinal side and with the first transversal side of the element frame.

15. The MEMS sensor of claim 14, wherein the first acute angle and the second acute angle are the same.

16. The MEMS sensor of claim 15, wherein the first acute angle and the second acute angle are acute 45°

angles, and wherein the spring axis forms an acute 45°

angle with the first longitudinal side and with the first transversal side of the element frame.

17. The MEMS sensor of claim 14, wherein the first acute angle and the second acute angle are different.

18. The MEMS sensor of claim 17, wherein a difference between the first acute angle and the second acute angle is adjusted to be eliminated by the rotor comb fingers becoming parallel to the stator comb fingers at maximum displacement, or half of the maximum displacement in the rotary mode of motion of the proof-mass.

19. A semiconductor package comprising at least one MEMS sensor for measuring acceleration, said at least one MEMS sensor comprising:

a substrate;

an element frame;

a spring anchor;

a proof-mass; and

a spring,

wherein the element frame and the spring anchor are rigidly fixed to the substrate,

wherein one end of the spring is connected to the proof-mass and an opposite end of the spring is connected to the spring anchor,

wherein in a non-flexed state of the spring, a spring axis extends between the opposite ends of the spring,

wherein the proof-mass and the spring extend along a common plane, whereby the spring suspends the proof-mass to a rotary mode of motion in the common plane,

wherein the element frame comprises a rectangular form such that in the common plane, an outer surface of the element frame has four sides, of which two longitudinal sides run in parallel in a longitudinal direction, and two transversal sides run in parallel in a transversal direction, wherein the transversal direction is perpendicular to the longitudinal direction,

wherein the rectangular form of the element frame includes a first longitudinal side and a first transversal side, connected by a first vertex that is closest to the spring anchor, and

wherein the spring axis forms an acute angle with the first longitudinal side and with the first transversal side, the spring is flexural and bends when subjected to forces in the in-plane direction perpendicular to the spring axis, and the spring is rigid when subjected to forces in any other direction, thereby causing an inherent sensitivity for measuring accelerations in a range covering accelerations in the longitudinal direction and in the transversal direction,

and wherein the sensor further comprises one or more comb capacitors configured to measure the accelerations, wherein each comb capacitor includes a set of rotor comb fingers coupled to move with the proof-mass and a set of stator comb fingers rigidly fixed to the substrate.

20. A semiconductor package comprising at least one MEMS sensor for measuring acceleration, said at least one MEMS sensor comprising:

a substrate;

an element frame;

a spring anchor;

a proof-mass; and

a spring,

wherein the element frame and the spring anchor are rigidly fixed to the substrate,

wherein one end of the spring is connected to the proof-mass and an opposite end of the spring is connected to the spring anchor,

wherein in a non-flexed state of the spring, a spring axis extends between the opposite ends of the spring,

wherein the proof-mass and the spring extend along a common plane, whereby the spring suspends the proof-mass to a rotary mode of motion in the common plane,

wherein the element frame comprises a rectangular form such that in the common plane, an outer surface of the element frame has four sides, of which two longitudinal sides run in parallel in a longitudinal direction, and two transversal sides run in parallel in a transversal direction, wherein the transversal direction is perpendicular to the longitudinal direction,

wherein the rectangular form of the element frame includes a first longitudinal side and a first transversal side, connected by a first vertex that is closest to the spring anchor, and

wherein the spring axis forms an acute angle with the first longitudinal side and with the first transversal side, the spring is flexural and bends when subjected to forces in the in-plane direction perpendicular to the spring axis, and the spring is rigid when subjected to forces in any other direction, thereby causing an inherent sensitivity for measuring accelerations in a range covering accelerations in the longitudinal direction and in the transversal direction, wherein the semiconductor package is configured for airbag use, the semiconductor package comprising at least two MEMS sensors, with the MEMS sensors being configured as at least one mid-g MEMS accelerometer, and at least one low-g MEMS accelerometer or at least one MEMS gyroscope.