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Process for the removal of contaminants from sputtering target substrates

  • US 10,138,545 B2
  • Filed: 02/02/2017
  • Issued: 11/27/2018
  • Est. Priority Date: 02/05/2016
  • Status: Active Grant
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1. A method for the removal of chromium contaminants on a ruthenium sputtering target used in plasma vapor deposition including the steps ofsubjecting the ruthenium sputtering target to grit abrasion followed by an organic solvent cleaning to result in a pre-cleaned target,subjecting the pre-cleaned target to an electric field in an acidic bath including a surfactant, followed by subsequent water and air rinse.

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