Vertically integrated optoelectronics package for MEMS devices
First Claim
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1. An integrated assembly comprising:
- a MEMS/optoelectronic module comprising a photonic circuit;
one or more emitter modules, wherein each emitter module comprises one or more vertically emitting light sources, wherein each vertically emitting light source is directly optically connected to a portion of the photonic circuit and configured to provide an optical input signal to the photonic circuit, wherein each emitter module is displaced in a direction normal to a plane of the photonic circuit, and wherein an optical axis of each vertically emitting light source is substantially parallel to the normal to the plane of the photonic circuit; and
one or more detector modules, wherein each detector module comprises one or more vertically integrated photodetectors, wherein each vertically integrated photodetector is directly optically connected to a portion of the photonic circuit and configured to receive an optical output signal from the photonic circuit and to transmit an electrical output signal, wherein each detector module is displaced in the direction normal to the plane of the photonic circuit, and wherein an optical axis of each vertically integrated photodetector is substantially parallel to the normal to the plane of the photonic circuit.
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Abstract
The present application relates to vertically integrated assemblies including a MEMS-based optomechanical architecture. In some embodiments, the assembly includes a MEMS/optoelectronic module, an emitter module, and a detector module, where these modules are vertically integrated. Methods of fabricating such assemblies are also described herein.
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Citations
20 Claims
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1. An integrated assembly comprising:
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a MEMS/optoelectronic module comprising a photonic circuit; one or more emitter modules, wherein each emitter module comprises one or more vertically emitting light sources, wherein each vertically emitting light source is directly optically connected to a portion of the photonic circuit and configured to provide an optical input signal to the photonic circuit, wherein each emitter module is displaced in a direction normal to a plane of the photonic circuit, and wherein an optical axis of each vertically emitting light source is substantially parallel to the normal to the plane of the photonic circuit; and one or more detector modules, wherein each detector module comprises one or more vertically integrated photodetectors, wherein each vertically integrated photodetector is directly optically connected to a portion of the photonic circuit and configured to receive an optical output signal from the photonic circuit and to transmit an electrical output signal, wherein each detector module is displaced in the direction normal to the plane of the photonic circuit, and wherein an optical axis of each vertically integrated photodetector is substantially parallel to the normal to the plane of the photonic circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of making an integrated assembly comprising:
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providing a MEMS/optoelectronic module comprising a photonic circuit and an electrical circuit, wherein the photonic circuit comprises one or more input resonant grating couplers, one or more output resonant grating couplers, and at least one optical waveguide optically connecting one input resonant grating coupler to one output resonant grating coupler; vertically aligning one or more emitter modules with at least one input resonant grating coupler each emitter module being displaced in a direction normal to a plane of the photonic circuit, and an optical axis of each emitter module being substantially parallel to the normal to the plane of the photonic circuit; vertically aligning one or more detector modules with at least one output resonant grating coupler, each detector module being displaced in a direction normal to the plane of the photonic circuit, and an optical axis of each detector module being substantially parallel to the normal to the plane of the photonic circuit; bonding each emitter module to the MEMS/optoelectronic module, thereby directly optically coupling the MEMS/optoelectronic module to each emitter module; and bonding each detector module to the MEMS/optoelectronic module, thereby directly optically coupling the MEMS/optoelectronic module to each detector module. - View Dependent Claims (16, 17, 18, 19)
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20. An integrated assembly comprising:
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a MEMS/optoelectronic module comprising a photonic circuit, wherein the photonic circuit comprises one or more input resonant grating couplers, one or more output resonant grating couplers, and at least one optical waveguide optically connecting one of the one or more input resonant grating couplers to one of the one or more output resonant grating couplers; an emitter module aligned with at least one of the one or more input resonant grating couplers, wherein the emitter module is bonded to the MEMS/optoelectronic module, wherein each emitter module is directly optically connected to a portion of the photonic circuit, wherein the emitter module is displaced in a direction normal to a plane of the photonic circuit, and wherein an optical axis of the emitter is substantially parallel to the normal to the plane of the photonic circuit; and a detector module aligned with at least one of the one or more output resonant grating couplers, wherein the detector module is bonded to the MEMS/optoelectronic module, wherein each detector module is directly optically connected to a portion of the photonic circuit, wherein the detector module is displaced in the direction normal to the plane of the photonic circuit, and wherein an optical axis of the detector module is substantially parallel to the normal to the plane of the photonic circuit.
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Specification