Techniques for achieving multiple transistor fin dimensions on a single die
First Claim
1. An integrated circuit including at least one transistor device, the integrated circuit comprising:
- a first fin above and native to a substrate, the first fin having a channel region, wherein the first fin includes a first width (W1) in a sub-channel region below the channel region and a second width (W2) in the channel region, W1 is greater than 15 nanometers (nm), W2 is 15 nm or less, and W1 is at least 1 nm greater than W2; and
a second fin above and native to the substrate, the second fin having a channel region, wherein the second fin includes a third width (W3) in the channel region, and W3 is different from W2.
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Abstract
Techniques are disclosed for achieving multiple fin dimensions on a single die or semiconductor substrate. In some cases, multiple fin dimensions are achieved by lithographically defining (e.g., hardmasking and patterning) areas to be trimmed using a trim etch process, leaving the remainder of the die unaffected. In some such cases, the trim etch is performed on only the channel regions of the fins, when such channel regions are re-exposed during a replacement gate process. The trim etch may narrow the width of the fins being trimmed (or just the channel region of such fins) by 2-6 nm, for example. Alternatively, or in addition, the trim may reduce the height of the fins. The techniques can include any number of patterning and trimming processes to enable a variety of fin dimensions and/or fin channel dimensions on a given die, which may be useful for integrated circuit and system-on-chip (SOC) applications.
23 Citations
24 Claims
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1. An integrated circuit including at least one transistor device, the integrated circuit comprising:
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a first fin above and native to a substrate, the first fin having a channel region, wherein the first fin includes a first width (W1) in a sub-channel region below the channel region and a second width (W2) in the channel region, W1 is greater than 15 nanometers (nm), W2 is 15 nm or less, and W1 is at least 1 nm greater than W2; and a second fin above and native to the substrate, the second fin having a channel region, wherein the second fin includes a third width (W3) in the channel region, and W3 is different from W2. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit, comprising:
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a first semiconductor fin having a channel portion and a sub-channel portion; a first trench adjacent the first semiconductor fin; a first isolation material in the first trench and in contact with the sub-channel portion of the first semiconductor fin; a first gate structure at least partially in the first trench and in contact with the channel portion of the first semiconductor fin; a second semiconductor fin having a channel portion and a sub-channel portion; a second trench adjacent the second semiconductor fin; a second isolation material in the second trench and in contact with the sub-channel portion of the second semiconductor fin; and a second gate structure at least partially in the second trench and in contact with the channel portion of the second semiconductor fin; wherein the channel portion of the first semiconductor fin has a first width, as measured in a cross-section passing through the sub-channel and channel portions of the first semiconductor fin and taken perpendicular to the first semiconductor fin, that is 2 to 6 nm greater than a corresponding first width of the second semiconductor fin, the first widths measured about midway the corresponding channel portion, and the first width of the second semiconductor fin is 10 nm or less but at least 5 nm; and wherein the sub-channel portion of the first semiconductor fin further has a second width, as measured in the cross-section, that is within 1 nm of a corresponding second width of the second semiconductor fin, the second widths measured about midway the corresponding sub-channel portion, the second widths both being greater than 10 nm but less than 20 nm. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification