Proximity detector device with interconnect layers and related methods

• US 10,141,471 B2
• Filed: 08/03/2017
• Issued: 11/27/2018
• Est. Priority Date: 04/28/2013
• Status: Active Grant

• Current Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: Luan, Jing-En
• Primary Examiner(s): Inoussa, Mouloucoulaye
• Application Number:
  US15/668,138
• Publication Number:
  US 20170330989A1
• Time in Patent Office: 481 Days
• Field of Search: 257 82, 257774, 257432, 438 25, 356614
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 17/08 for measuring distance only indirect measurement G01S17/46; active triangulation systems G01S17/48
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate

Abstract

A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

Claims

1. A device, comprising:

a first interconnect layer comprising a first dielectric layer and a plurality of first electrically conductive traces;

an integrated circuit (IC) layer overlying the first interconnect layer and comprising an image sensor IC and a light source IC laterally spaced from the image sensor IC;

a second interconnect layer overlying the IC layer and comprising a second dielectric layer and a plurality of second electrically conductive traces, the second interconnect layer having first and second openings respectively aligned with the image sensor IC and the light source IC, the image sensor IC and the light source IC being electrically coupled to the plurality of first electrically conductive traces and the plurality of second electrically conductive traces;

a transparent adhesive material filling the first and second openings and contacting surfaces of the image sensor IC and the light source IC;

a lens assembly overlying the second interconnect layer and comprising first and second lenses respectively aligned with the first and second openings, the first and second lenses being adhered to the transparent adhesive material; and

a plurality of contacts coupled respectively to the plurality of first electrically conductive traces.

2. The device of claim 1, wherein the plurality of contacts comprises a plurality of ball grid array (BGA) contacts.

3. The device of claim 1, wherein a surface of the first dielectric layer directed away from the IC layer is coplanar to a surface of the plurality of first electrically conductive traces.

4. The device of claim 1, wherein the IC layer further comprises encapsulation material laterally surrounding the image sensor IC and the light source IC.

5. The device of claim 4, wherein the IC layer further comprises a plurality of electrically conductive vias extending through the encapsulation material, each of the plurality of electrically conductive vias being coupled between a respective aligned pair of the pluralities of first and second electrically conductive traces.

6. The device of claim 1, wherein the first and second openings have sidewalls defined by at least the second dielectric layer.

7. The device of claim 1, wherein the lens assembly further comprises a molding compound surrounding the first and second lenses, and having third and fourth openings aligned with respective ones of the first and second lenses.

8. The device of claim 1, wherein the transparent adhesive material completely fills the first and second openings.

9. The device of claim 8, wherein at least a portion of the transparent adhesive material extends into a portion of the lens assembly.

10. A device, comprising:

a first interconnect layer comprising a plurality of first electrically conductive traces;

a plurality of ball grid array (BGA) contacts coupled to a first surface of the plurality of first electrically conductive traces;

an integrated circuit (IC) layer over a second surface of the plurality of first electrically conductive traces and comprising;

an image sensor IC;

a light source IC laterally spaced from the image sensor IC; and

an encapsulant laterally surrounding the image sensor IC and the light source IC;

a second interconnect layer over the IC layer and comprising a plurality of second electrically conductive traces, the second interconnect layer having first and second openings defined by a dielectric material of the second interconnect layer, the first and second openings being respectively aligned with the image sensor IC and the light source IC;

a lens assembly above the second interconnect layer and comprising first and second lenses respectively aligned with the first and second openings; and

a transparent adhesive material completely filling the first and second openings of the second interconnect layer, the transparent adhesive material having surfaces adhered to and physically contacting each of the first and second lenses, the image sensor IC, and the light source IC.

11. The device of claim 10, wherein the first lens comprises a filter lens.

12. The device of claim 10, wherein the light source IC comprises a light emitting diode.

13. The device of claim 10, further comprising a plurality of electrically conductive vias, each coupled between a respective aligned pair of the plurality of first electrically conductive traces and the plurality of second electrically conductive traces.

14. The device of claim 10, wherein the lens assembly further comprises a molding compound laterally surrounding the first and second lenses, the molding compound having first and second openings aligned with respective ones of the first and second lenses.

15. A device, comprising:

a first interconnect layer comprising a first dielectric layer and a plurality of first electrically conductive traces, wherein an externally-facing surface of the first dielectric layer is coplanar to an externally-facing surface of the plurality of first electrically conductive traces;

an integrated circuit (IC) layer overlying the first interconnect layer and comprising an image sensor IC and a light source IC laterally spaced from the image sensor IC;

a second interconnect layer overlying the IC layer and comprising a second dielectric layer and a plurality of second electrically conductive traces, the second interconnect layer having a first opening and a second opening respectively aligned with the image sensor IC and the light source IC, the image sensor IC and the light source IC being electrically coupled to the plurality of first electrically conductive traces and the plurality of second electrically conductive traces; and

a lens assembly overlying the second interconnect layer and comprising a first lens and a second lens respectively aligned with the first opening and the second opening;

a transparent adhesive material disposed within the first opening and the second opening and physically contacting surfaces of the image sensor IC and the light source IC directed away from the first interconnect layer, the transparent adhesive material extending out of the second interconnect layer into a portion of the lens assembly, the first and second lenses being adhered to the transparent adhesive material; and

a plurality of contacts coupled respectively to the plurality of first electrically conductive traces.

16. The device of claim 15, wherein the IC layer further comprises a first encapsulation material laterally surrounding the image sensor IC and the light source IC.

17. The device of claim 15, wherein the image sensor IC and the light source IC are electrically coupled to the plurality of second electrically conductive traces at surfaces of the image sensor IC and the light source IC directed away from the first interconnect layer.

18. The device of claim 17, wherein the plurality of second electrically conductive traces is electrically coupled to the plurality of first electrically conductive traces by electrically conductive vias extending through the IC layer.

19. The device of claim 15, wherein the first lens comprises a filter lens.

20. The device of claim 15, wherein the lens assembly comprises a second encapsulation material laterally surrounding the first lens and the second lens, the second encapsulation material further overlying portions of externally-facing surfaces of the first lens and the second lens, the second encapsulation material comprising a third opening and a fourth opening respectively aligned with the first lens and the second lens.