Volumetric scan automotive radar with end-fire antenna on partially laminated multi-layer PCB

• US 10,141,636 B2
• Filed: 09/28/2016
• Issued: 11/27/2018
• Est. Priority Date: 09/28/2016
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Inventors: Lee, Jae Seung
• Primary Examiner(s): Gregory, Bernarr E
• Application Number:
  US15/279,291
• Publication Number:
  US 20180090827A1
• Time in Patent Office: 790 Days
• Field of Search: None
• CPC Class Codes: G01S 13/931 of land vehicles
• CPC Class Codes: G01S 7/03 Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• CPC Class Codes: G01S 7/032 Constructional details for solid-state radar subsystems
• CPC Class Codes: H01Q 1/3233 particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
• CPC Class Codes: H01Q 1/3283 side-mounted antennas, e.g. bumper-mounted, door-mounted mounted on windscreens H01Q1/1271
• CPC Class Codes: H01Q 13/085 Slot-line radiating ends
• CPC Class Codes: H01Q 21/067 using endfire radiating aerial units transverse to the plane of the array

Abstract

A vehicular radar system includes a first printed circuit board (PCB) having a first material. The vehicular radar system also includes a plurality of end-fire antennas positioned on the first PCB. The vehicular radar system also includes a second PCB stacked on or under the first PCB and having a second material that has a greater rigidity than the first material. The vehicular radar system also includes a radio frequency integrated circuit (RFIC) coupled to the plurality of end-fire antennas and configured to control the plurality of end-fire antennas.

Claims

1. A vehicular radar system comprising:

a first printed circuit board (PCB) having a first material;

a plurality of end-fire antennas positioned on the first PCB;

a second PCB stacked on or under the first PCB and having a second material that has a greater rigidity than the first material; and

a radio frequency integrated circuit (RFIC) coupled to the plurality of end-fire antennas and configured to control the plurality of end-fire antennas.

2. The vehicular radar system of claim 1 wherein the first PCB has a chip connection end and a transmission end and wherein the second PCB is stacked on or under the first PCB between the chip connection end and a line parallel to and positioned between the chip connection end and the transmission end such that the transmission end of the first PCB is separated from the second PCB.

3. The vehicular radar system of claim 2 wherein the first PCB has a top and a bottom and each of the plurality of end-fire antennas includes:

a ground structure positioned adjacent to the chip connection end of the first PCB on the bottom of the first PCB;

a chip connection lead positioned adjacent to the chip connection end of the first PCB and electrically coupled to the RFIC;

a balun positioned adjacent to the chip connection lead and configured to convert an unbalanced signal to a balanced signal or to convert a balanced signal to an unbalanced signal;

a wave section having a first wave section and a second wave section separated by a space and configured to transmit a wireless radar signal; and

a tapered section positioned between the balun and the wave section and tapered towards the balun from the wave section.

4. The vehicular radar system of claim 3 wherein the second PCB is coupled to the top or the bottom of the first PCB and positioned between the balun of each of the plurality of end-fire antennas and the chip connection end of the first PCB.

5. The vehicular radar system of claim 2 wherein the first material is malleable and a portion of the first PCB between the transmission end and the line is bent to orient the transmission end of the first PCB in a desired direction.

6. The vehicular radar system of claim 2 further comprising a housing at least partially enclosing the second PCB and a portion of the first PCB between the transmission end and the line.

7. The vehicular radar system of claim 1 wherein the first material includes RO3003 and the second material includes FR4.

8. The vehicular radar system of claim 1 wherein:

the first PCB has a top;

the RFIC is connected to the top of the first PCB; and

the second PCB is positioned on the top of the first PCB and defines a chip aperture for receiving the RFIC.

9. A vehicular radar system comprising:

a first radar board having;

a first printed circuit board (PCB) made of a first material and having a chip connection end and a transmission end, and

a first plurality of end-fire antennas;

a second radar board having;

a second PCB made of the first material and having a chip connection end and a transmission end, and

a second plurality of end-fire antennas;

a third PCB stacked between the first PCB and the second PCB and made of a second material that has a greater rigidity than the first material; and

at least one radio frequency integrated circuit (RFIC) coupled to the first plurality of end-fire antennas and the second plurality of end-fire antennas and configured to control each of the first plurality of end-fire antennas and each of the second plurality of end-fire antennas.

10. The vehicular radar system of claim 9 wherein the third PCB is stacked between the first PCB and the second PCB between the chip connection end and a line parallel to and positioned between the chip connection end and the transmission end such that the transmission end of the first PCB and the second PCB is separated from the third PCB.

11. The vehicular radar system of claim 10 wherein each of the first PCB and the second PCB has a top and a bottom and each of the first plurality of antennas and the second plurality of antennas includes:

a ground structure positioned adjacent to the chip connection end of the first PCB or the second PCB on the bottom of the first PCB or the second PCB;

a chip connection lead positioned adjacent to the chip connection end of the first PCB or the second PCB and electrically coupled to the RFIC;

a balun positioned adjacent to the chip connection lead and configured to convert an unbalanced signal to a balanced signal or to convert a balanced signal to an unbalanced signal;

a wave section having a first wave section and a second wave section separated by a space and configured to transmit a wireless radar signal; and

a tapered section positioned between the balun and the wave section and tapered towards the balun from the wave section.

12. The vehicular radar system of claim 11 wherein the third PCB is coupled to the bottom of the first PCB and the top of the second PCB and positioned between the balun of each of the first plurality of end-fire antennas and the second plurality of antennas and the chip connection end of the first PCB and the second PCB.

13. The vehicular radar system of claim 10 wherein the first material is malleable and a portion of the first PCB between the transmission end and the line is bent to orient the transmission end of the first PCB in a direction away from the second PCB.

14. The vehicular radar system of claim 10 wherein the first material is malleable and the first PCB is bent at a first location between the transmission end and the line to separate the first PCB from the second PCB and is bent at a second location between the transmission end and the first location to cause the transmission end of the first PCB to be parallel to the transmission end of the first PCB.

15. The vehicular radar system of claim 9 wherein:

the second PCB has a top;

one of the at least one RFIC is connected to the top of the second PCB;

the third PCB has a bottom coupled to the top of the second PCB and a top and defines a chip aperture for receiving the RFIC; and

the first PCB has a bottom coupled to the top of the third PCB and defines another chip aperture for receiving the RFIC.

16. A vehicular radar system comprising:

a first printed circuit board (PCB) having a chip connection end, a transmission end, a top, and a bottom;

a plurality of end-fire antennas positioned on the first PCB each having;

a ground structure positioned adjacent to the chip connection end of the first PCB on the bottom of the first PCB,

a chip connection lead positioned adjacent to the chip connection end of the first PCB and electrically coupled to the RFIC,

a balun positioned adjacent to the chip connection lead and configured to convert an unbalanced signal to a balanced signal or to convert a balanced signal to an unbalanced signal,

a wave section having a first wave section and a second wave section separated by a space and configured to transmit a wireless radar signal, and

a tapered section positioned between the balun and the wave section and tapered towards the balun from the wave section;

a second PCB coupled to the top or the bottom of the first PCB, having a greater rigidity than the first PCB, and positioned between the balun of each of the plurality of end-fire antennas and the chip connection end of the first PCB; and

a radio frequency integrated circuit (RFIC) coupled to the plurality of end-fire antennas and configured to control the plurality of end-fire antennas.

17. The vehicular radar system of claim 16 wherein the first PCB has a first material and the second PCB has a second material that has a greater rigidity than the first material.

18. The vehicular radar system of claim 16 further comprising a housing at least partially enclosing the second PCB and a portion of the first PCB between the balun of each of the plurality of end-fire antennas and the chip connection end of the first PCB.

19. The vehicular radar system of claim 16 wherein the first PCB is malleable and a portion of the first PCB between the transmission end and the balun is bent to orient the transmission end of the first PCB in a desired direction.

20. The vehicular radar system of claim 16 wherein:

the first PCB has a top;

the RFIC is connected to the top of the first PCB; and

the second PCB is positioned on the top of the first PCB and defines a chip aperture for receiving the RFIC.