Method and system for a distributed receiver
First Claim
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1. A first semiconductor die comprising:
- an interface receiver circuit operable to;
receive an externally-generated signal that carries decision outputs of a symbol de-mapper that is external to the first semiconductor die, the externally-generated signal comprising a plurality of time stamps, each one of the plurality of time stamps corresponding to one of the decision outputs of the symbol de-mapper, andprocess the externally-generated signal to recover the decision outputs of the symbol de-mapper carried in the externally-generated signal; and
a demodulation circuit operable to recover one datastreams based on the decision outputs of the symbol de-mapper.
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Abstract
A first semiconductor die may comprise an interface circuit and a demodulation circuit. The interface circuit may be operable to receive an externally generated signal and recover decisions of a symbol de-mapper carried in the externally generated signal. The demodulation circuit may be operable to recover one or more transport streams based on the decisions of the symbol de-mapper. The first semiconductor die may comprise circuitry operable to combine a plurality of signals from a plurality of second semiconductor dice, where each of the plurality of signals comprises decisions of a respective one of a plurality of symbol de-mappers.
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Citations
20 Claims
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1. A first semiconductor die comprising:
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an interface receiver circuit operable to; receive an externally-generated signal that carries decision outputs of a symbol de-mapper that is external to the first semiconductor die, the externally-generated signal comprising a plurality of time stamps, each one of the plurality of time stamps corresponding to one of the decision outputs of the symbol de-mapper, and process the externally-generated signal to recover the decision outputs of the symbol de-mapper carried in the externally-generated signal; and a demodulation circuit operable to recover one datastreams based on the decision outputs of the symbol de-mapper. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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recovering, via an interface receiver circuit in a first semiconductor die, decision outputs of a symbol de-mapper carried in an externally-generated signal, wherein the symbol de-mapper is external to the first semiconductor die, the externally-generated signal comprising a plurality of time stamps, each one of the plurality of time stamps corresponding to one of the decision outputs of the symbol de-mapper; and recovering, via a demodulation circuit in the first semiconductor die, one or more datastreams based on the decision outputs of the symbol de-mapper. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor die comprising:
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an interface receiver circuit operable to; receive an externally-generated signal that carries decision outputs of a symbol de-mapper that is external to the first semiconductor die, the externally-generated signal comprising a plurality of time stamps, each one of the plurality of time stamps corresponding to one of the decision outputs of the symbol de-mapper, and process the externally-generated signal to recover the decision outputs of the symbol de-mapper carried in the externally-generated signal, wherein the decision outputs of the symbol de-mapper are selected to be one of a plurality of hard symbols and a plurality of soft symbols; and a demodulation circuit operable to recover one datastreams based on the decision outputs of the symbol de-mapper. - View Dependent Claims (18, 19, 20)
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Specification