Micro electro mechanical system

• US 10,145,686 B2
• Filed: 10/21/2016
• Issued: 12/04/2018
• Est. Priority Date: 08/18/2008
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Degawa, Munenori, Jeong, Heewon
• Primary Examiner(s): Kwok, Helen C
• Application Number:
  US15/299,772
• Publication Number:
  US 20170038210A1
• Time in Patent Office: 774 Days
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: G01C 19/5712 the devices involving a micromechanical structure
• CPC Class Codes: G01C 19/5733 Structural details or topology
• CPC Class Codes: G01P 1/003 used for damping
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

In order to provide a technology capable of suppressing degradation of measurement accuracy due to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+σ₁) occurs in the beam 4a and a compressive stress (−σ₂) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.

Claims

1. A micro electro mechanical system comprising a sensor element,

the sensor element including:

a movable body displaceable in a predetermined displacement direction;

a first spring system having a first fixed portion fixed to the substrate, a first turning portion, an elastically deformable first beam connected at one end to the first fixed portion and at another end to the first turning portion, an elastically deformable second beam connected at one end to the first turning portion and at another end to the movable body, and an elastically deformable third beam connected at one end to the first turning portion and at another end to the movable body; and

a second spring system having a second fixed portion fixed to the substrate, a second turning portion, an elastically deformable fourth beam connected at one end to the second fixed portion and at another end to the second turning portion, an elastically deformable fifth beam connected at one end to the second turning portion and at another end to the movable body, and an elastically deformable sixth beam connected at one end to the second turning portion and at another end to the movable body,

wherein the first to sixth beams extend in a perpendicular direction perpendicular to the displacement direction, and

when a straight line passing through a center of the sensor element in the perpendicular direction and extending in the displacement direction is defined as a center line, the first fixed portion and the second fixed portion are disposed on opposite sides with respect to the center line.

4. The micro electro mechanical system according to claim 1, further comprising:

a substrate in which the first fixed portion and the second fixed portion are provided,

wherein when the substrate is deformed, the first fixed portion and the second fixed portion are displaced in opposite directions.

5. The micro electro mechanical system according to claim 1,

wherein the second beam and the third beam are provided outside the first beam, and

the fifth beam and the sixth beam are provided outside the fourth beam.

6. The micro electro mechanical system according to claim 1,

wherein a number of beams included in the first spring system is equal to a number of beams included in the second spring system.

7. The micro electro mechanical system according to claim 1,

wherein the first turning portion is provided outside the first fixed portion with respect to the center line, and the second turning portion is provided inside the second fixed portion with respect to the center line.

8. The micro electro mechanical system according to claim 1,

wherein the first spring system further has an elastically deformable seventh beam connected to the first fixed portion and the first turning portion, and

the second spring system further has an elastically deformable eighth beam connected to the second fixed portion and the second turning portion.

9. The micro electro mechanical system according to claim 1,

wherein the sensor element is formed on a first semiconductor chip, and

the first semiconductor chip is mounted on an underlayer substrate via an adhesive agent.

10. The micro electro mechanical system according to claim 9,

wherein the underlayer substrate is a second semiconductor chip in which an integrated circuit is formed.

11. The micro electro mechanical system according to claim 1,

wherein the sensor element is an angular velocity sensor.

2. A micro electro mechanical system comprising:

a substrate;

a movable body displaceable in a predetermined displacement direction;

a first spring system having a first fixed portion fixed to the substrate, a first turning portion, an elastically deformable first beam connected at one end to the first fixed portion and at another end to the first turning portion, an elastically deformable second beam connected at one end to the first turning portion and at another end to the movable body, and an elastically deformable third beam connected at one end to the first turning portion and at another end to the movable body; and

a second spring system having a second fixed portion fixed to the substrate, a second turning portion, an elastically deformable fourth beam connected at one end to the second fixed portion and at another end to the second turning portion, an elastically deformable fifth beam connected at one end to the second turning portion and at another end to the movable body, and an elastically deformable sixth beam connected at one end to the second turning portion and at another end to the movable body,

wherein the first to sixth beams extend in a perpendicular direction perpendicular to the displacement direction, and

when the substrate is deformed, the first fixed portion and the second fixed portion are displaced in opposite directions.

3. A micro electro mechanical system comprising a sensor element,

the sensor element including:

a movable body displaceable in a predetermined displacement direction;

a first spring system having a first fixed portion fixed to the substrate, a first turning portion, an elastically deformable first beam connected at one end to the first fixed portion and at another end to the first turning portion, an elastically deformable second beam connected at one end to the first turning portion and at another end to the movable body, and an elastically deformable third beam connected at one end to the first turning portion and at another end to the movable body; and

a second spring system having a second fixed portion fixed to the substrate, a second turning portion, an elastically deformable fourth beam connected at one end to the second fixed portion and at another end to the second turning portion, an elastically deformable fifth beam connected at one end to the second turning portion and at another end to the movable body, and an elastically deformable sixth beam connected at one end to the second turning portion and at another end to the movable body,

wherein the first to sixth beams extend in a perpendicular direction perpendicular to the displacement direction, and

when a straight line passing through a center of the sensor element in the perpendicular direction and extending in the displacement direction is defined as a center line, the first fixed portion and the second fixed portion are disposed at positions sandwiching the center line.