Semiconductor wafer inspection using care area group-specific threshold settings for detecting defects

• US 10,146,036 B2
• Filed: 06/07/2016
• Issued: 12/04/2018
• Est. Priority Date: 06/07/2016
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Dhagat, Parul, Raghunathan, Ananthan, Sachan, Vikas, Vengertsev, Dmitry A.
• Primary Examiner(s): Tucker, Wesley J
• Application Number:
  US15/175,101
• Publication Number:
  US 20170352145A1
• Time in Patent Office: 910 Days
• CPC Class Codes: G02B 21/0016 Technical microscopes, e.g. for inspection or measuring in industrial production processes
• CPC Class Codes: G02B 21/002 Scanning microscopes scanning near field optical microscopes G01Q60/18
• CPC Class Codes: G06T 2207/10004 Still image; Photographic image
• CPC Class Codes: G06T 2207/10061 from scanning electron microscope
• CPC Class Codes: G06T 2207/20012 Locally adaptive
• CPC Class Codes: G06T 2207/20021 Dividing image into blocks, subimages or windows
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection

Abstract

In the methods and systems, optical images of inspection care areas on a semiconductor wafer are acquired and analyzed to detect defects. However, during this analysis, the same threshold setting is not used for all inspection care areas. Instead, care areas are grouped into different care area groups, based on different design layouts and properties. Each group is associated with a corresponding threshold setting that is optimal for detecting defects in the inspection care areas belonging to that group. The assignment of the care areas to the different groups and the association of the different threshold settings with the different groups are noted in an index. This index is accessible during the analysis and used to ensure that each of the inspection care areas in a specific care area group is analyzed based on a corresponding threshold setting that is optimal for that specific care area group.

Claims

1. A method comprising:

receiving, by a processor from an optical inspection tool, optical images of multiple care areas on a semiconductor wafer; and

,

analyzing, by the processor, the optical images to detect defects in the care areas, the analyzing comprising;

accessing an index of the care areas stored in memory, wherein the index indicates assignment of the care areas to different care area groups that are associated with different combinations of at least two of the following different design properties;

pattern density levels, percentages of edges oriented in an x-direction and a y-direction and pattern complexity levels and wherein the index further associates different threshold settings for detecting defects with the different care area groups, respectively; and

,

using the index such that each care area in each specific care area group is analyzed based on a corresponding threshold setting associated in the index with the specific care area group.

2. The method of claim 1, wherein the different care area groups comprise:

a first group being a high pattern density, high y-direction, high complexity group;

a second group being a high pattern density, high y-direction, low complexity group;

a third group being a high pattern density, high x-direction, high complexity group;

a fourth group being a high pattern density, high x-direction, low complexity group;

a fifth group being a low pattern density, high y-direction, high complexity group;

a sixth group being a low pattern density, high y-direction, low complexity group;

a seventh group being a low pattern density, high x-direction, high complexity group; and

an eighth group being a low pattern density, high x-direction, low complexity group.

3. The method of claim 1, further comprising generating, by the processor, the index, the generating comprising:

accessing, by the processor from the memory, a design layout for the semiconductor wafer;

defining, by the processor, the care areas throughout the design layout;

assigning, by the processor, the care areas to the different care area groups based on the different design properties; and

,

determining, by the processor for each given care area group, a given threshold setting that is optimal for detecting defects in any of the care areas sorted into that given care area group.

4. The method of claim 3, the defining of the care areas being performed based on any of the following:

results of optical rule checking and optical proximity correction processes;

patterned shapes;

rules associated with the patterned shapes; and

functional blocks.

5. The method of claim 3, the assigning comprising:

determining pattern density levels for the care areas and sorting all the care areas into at least two initial groups based on the pattern density levels;

determining percentages of edges in an x-direction and a y-direction for all the care areas and sorting the care areas in each initial group into at least two intermediate groups based on the percentages; and

determining pattern complexity levels for all the care areas and sorting each intermediate group into at least two final groups based on the pattern complexity levels.

6. The method of claim 5, the pattern complexity levels for the care areas being determined based on numbers of vertices in patterned shapes in the care areas.

7. The method of claim 1, further comprising selecting a sample of the care areas for further inspection by a scanning electron-beam microscope to acquire scanning electron-beam microscope images and analyzing the scanning electron-beam microscope images to classify any defects detected in the sample by type.

8. The method of claim 7, the selecting being random.

9. The method of claim 7, further comprising:

before the selecting, ranking defects of interest that can be identified by the optical inspection tool based on probability of impacting yield such that a high ranked defect of interest has a relatively high probability of impacting yield and a low ranked defect of interest has a relatively low probability of impacting yield; and

ranking the different care area groups based on probability of having high ranked defects,

the selecting comprising selecting the sample based on results of the ranking.

10. A system comprising:

a memory storing an index of care areas on a semiconductor wafer, wherein the index indicates assignment of the care areas to different care area groups that are associated with different combinations of at least two of the following different design properties;

pattern density levels, percentages of edges oriented in an x-direction and a y-direction and pattern complexity levels and wherein the index further associates different optimal sensitivity thresholds for detecting defects with the different care area groups; and

,

an optical inspection tool; and

a processor in communication with the memory and with the optical inspection tool,

the processor receiving, from the optical inspection tool, optical images of the care areas, and

the processor analyzing the optical images to detect defects in the care areas, the analyzing comprising accessing the index from the memory and using the index such that each care area in each specific care area group is analyzed based on a corresponding threshold setting associated in the index with the specific care area group.

11. The system of claim 10, wherein the different care area groups comprise:

a first group being a high pattern density, high y-direction, high complexity group;

a second group being a high pattern density, high y-direction, low complexity group;

a third group being a high pattern density, high x-direction, high complexity group;

a fourth group being a high pattern density, high x-direction, low complexity group;

a fifth group being a low pattern density, high y-direction, high complexity group;

a sixth group being a low pattern density, high y-direction, low complexity group;

a seventh group being a low pattern density, high x-direction, high complexity group; and

an eighth group being a low pattern density, high x-direction, low complexity group.

12. The system of claim 10, the memory further storing a design layout for the semiconductor wafer and the processor generating the index by performing the following:

accessing the design layout;

defining the care areas throughout the design layout;

assigning the care areas to the different care area groups based on the different design properties; and

determining, for each given care area group, a given threshold setting that is optimal for detecting defects in any of the care areas sorted into that given care area group.

13. The system of claim 12, the processor defining the care areas based on any of the following:

results of optical rule checking and optical proximity correction processes;

patterned shapes;

rules associated with the patterned shapes; and

functional blocks.

14. The system of claim 12, the processor assigning the care areas to the different care area groups by performing the following:

determining pattern density levels for the care areas and sorting all the care areas into at least two initial groups based on the pattern density levels;

determining percentages of edges in an x-direction and a y-direction for all the care areas and sorting the care areas in each initial group into at least two intermediate groups based on the percentages; and

determining pattern complexity levels for all the care areas and sorting each intermediate group into at least two final groups based on the pattern complexity levels.

15. The system of claim 14, the processor determining the pattern complexity levels for the care areas being determined based on numbers of vertices in patterned shapes in the care areas.

16. The system of claim 10, further comprising a scanning electron-beam microscope and the processor further selecting a sample of the care areas for further inspection by the scanning electron-beam microscope to acquire scanning electron-beam microscope images and analyzing the scanning electron-beam microscope images to classify any defects detected in the sample by type.

17. The system of claim 16, the processor performing the selecting of the sample randomly.

18. The system of claim 16, the processor further performing the following:

before the selecting of the sample, ranking defects of interest that can be identified by the optical inspection tool based on probability of impacting yield such that a high ranked defect of interest has a relatively high probability of impacting yield and a low ranked defect of interest has a relatively low probability of impacting yield; and

ranking the different care area groups based on probability of having high ranked defects of interest,

the processor performing the selecting of the sample based on results of the ranking.

19. A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions being executable by a processor to cause the processor to perform a method, the method comprising:

receiving, from an optical inspection tool, optical images of multiple care areas on a semiconductor wafer; and

,

analyzing, by the processor, the optical images to detect defects in the care areas, the analyzing comprising;

accessing an index of the care areas stored in memory, wherein the index indicates assignment of the care areas to different care area groups that are associated with different combinations of at least two of the following different design properties;

pattern density levels, percentages of edges oriented in an x-direction and a y-direction and pattern complexity levels and wherein the index further associates different threshold settings for detecting defects with the different care area groups, respectively; and

,

using the index such that each care area in each specific care area group is analyzed based on a corresponding threshold setting associated in the index with the specific care area group.

20. The computer program product of claim 19, wherein the different care area groups comprise:

a first group being a high pattern density, high y-direction, high complexity group;

a second group being a high pattern density, high y-direction, low complexity group;

a third group being a high pattern density, high x-direction, high complexity group;

a fourth group being a high pattern density, high x-direction, low complexity group;

a fifth group being a low pattern density, high y-direction, high complexity group;

a sixth group being a low pattern density, high y-direction, low complexity group;

a seventh group being a low pattern density, high x-direction, high complexity group; and

an eighth group being a low pattern density, high x-direction, low complexity group.