Method for assembling fingerprint identification module
First Claim
1. A method for assembling a fingerprint identification module, the method comprising steps of:
- (A) combining a protective cover and a fingerprint sensing element together;
(B) placing the fingerprint sensing element on a first region of a circuit board, and placing a triggering element on a second region of the circuit board, wherein the fingerprint sensing element is located beside the triggering element;
(C) obtaining an adhesive thickness according to thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board; and
(D) allowing an adhesive film corresponding to the adhesive thickness to be placed on the circuit board, and allowing the first region of the circuit board to be folded and stacked on the second region of the circuit board, so that the fingerprint identification module is assembled, wherein the adhesive film is arranged between the second region of the circuit board and the folded first region of the circuit board,wherein after the step (A) and before the step (B), the method further comprises;
turning the protective cover upside down, and placing the protective cover on a thin film;
sheathing a metallic ring around the protective cover, wherein the thin film and the protective cover are disposed within an opening of the metallic ring;
fixing the metallic ring on the protective cover; and
removing the thin film from the opening of the metallic ring, so that there is a height difference between the metallic ring and the protective cover.
1 Assignment
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Accused Products
Abstract
A method for assembling the fingerprint identification module is provided. Firstly, a protective cover and a fingerprint sensing element are combined together. Then, the fingerprint sensing element is placed on the circuit board. Then, a triggering element is placed on the circuit board. Then, an adhesive thickness is obtained according to a predetermined thickness and the thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board. Then, an adhesive film corresponding to the adhesive thickness is placed on the circuit board. Since the appropriate adhesive film is selected according to the demand, the thickness of the fingerprint identification module is substantially identical to the predetermined thickness.
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Citations
9 Claims
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1. A method for assembling a fingerprint identification module, the method comprising steps of:
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(A) combining a protective cover and a fingerprint sensing element together; (B) placing the fingerprint sensing element on a first region of a circuit board, and placing a triggering element on a second region of the circuit board, wherein the fingerprint sensing element is located beside the triggering element; (C) obtaining an adhesive thickness according to thicknesses of the protective cover, the fingerprint sensing element, the triggering element and the circuit board; and (D) allowing an adhesive film corresponding to the adhesive thickness to be placed on the circuit board, and allowing the first region of the circuit board to be folded and stacked on the second region of the circuit board, so that the fingerprint identification module is assembled, wherein the adhesive film is arranged between the second region of the circuit board and the folded first region of the circuit board, wherein after the step (A) and before the step (B), the method further comprises; turning the protective cover upside down, and placing the protective cover on a thin film; sheathing a metallic ring around the protective cover, wherein the thin film and the protective cover are disposed within an opening of the metallic ring; fixing the metallic ring on the protective cover; and removing the thin film from the opening of the metallic ring, so that there is a height difference between the metallic ring and the protective cover. - View Dependent Claims (2, 3, 4, 5, 8, 9)
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6. A method for assembling a fingerprint identification module, the method comprising steps of:
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(A) combining a protective cover and a fingerprint sensing element together; (B) placing the fingerprint sensing element on a first circuit board; (C) placing a triggering element on a second circuit board; (D) obtaining an adhesive thickness according to thicknesses of the protective cover, the fingerprint sensing element, the triggering element, the first circuit board and the second circuit board; and (E) allowing an adhesive film corresponding to the adhesive thickness to be placed on the first circuit board, and allowing the second circuit board and the adhesive film to be stacked on each other, so that the fingerprint identification module is assembled, wherein the adhesive film is arranged between the first circuit board and the second circuit board, wherein after the step (A) and before the step (B), the method further comprises; turning the protective cover upside down, and placing the protective cover on a thin film; sheathing a metallic ring around the protective cover, wherein the thin film and the protective cover are disposed within an opening of the metallic ring; fixing the metallic ring on the protective cover; and removing the thin film from the opening of the metallic ring, so that there is a height difference between the metallic ring and the protective cover. - View Dependent Claims (7)
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Specification