Display module and system applications

• US 10,147,711 B2
• Filed: 02/28/2018
• Issued: 12/04/2018
• Est. Priority Date: 12/17/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Bibl, Andreas, Sakariya, Kapil V., Pavate, Vikram
• Primary Examiner(s): Shankar, Vijay
• Application Number:
  US15/908,505
• Publication Number:
  US 20180190632A1
• Time in Patent Office: 279 Days
• CPC Class Codes: G04G 9/10 by controlling light sources, e.g. electroluminescent diodes G04G9/0058 takes precedence
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/1652 the display being flexible, e.g. mimicking a sheet of paper, or rollable
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/042 by opto-electronic means
• CPC Class Codes: G06F 3/14 Digital output to display device ; Cooperation and interconnection of the display device with other functional units
• CPC Class Codes: G09G 2380/02 Flexible displays
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3171 the coating being directly applied to the semiconductor body, e.g. passivation layer H01L23/3178 takes precedence
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0216 Coatings H01L31/041 takes precedence
• CPC Class Codes: H01L 31/16 the semiconductor device sensitive to radiation being controlled by the light source or sources
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/115 : Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/147 : at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 : Display

Abstract

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Claims

1. An electronic device comprising:

a substrate including a first side and a second side;

a first wiring layer on the first side;

an array of LEDs on and in electrical contact with the first wiring layer on the first side of the substrate;

a plurality of interconnects extending through the substrate from the first side to the second side; and

a second wiring layer on the second side of the substrate.

2. The electronic device of claim 1, further comprising an array of micro chips connected with the first wiring layer to drive the array of LEDs.

3. The electronic device of claim 2, wherein each micro chip is connected with a corresponding plurality of LEDs.

4. The electronic device of claim 3, wherein the array of LEDs is located in a display area of the display substrate.

5. The electronic device of claim 4, further comprising a timing controller chip electrically connected with the second wiring layer.

6. The electronic device of claim 5, wherein the array of micro chips is interspersed among the array of LEDs.

7. The electronic device of claim 4, further comprising a plurality of integrated circuit (IC) chips in electrical connection with the second wiring layer.

8. The electronic device of claim 7, wherein the plurality of interconnects are located outside of the display area.

9. The electronic device of claim 7, wherein the plurality of interconnects are located directly behind the display area.

10. The electronic device of claim 7, further comprising a driver integrated circuit (IC) chip on the first side of the substrate and in electrical connection with the first wiring layer.

11. The electronic device of claim 10, wherein the substrate is a multi-layer substrate.

12. The electronic device of claim 10, wherein the substrate is a single layer substrate.

13. The electronic device of claim 1, further comprising a driver IC chip on the first side of the substrate and in electrical connection with the first wiring layer.

14. The electronic device of claim 13, wherein the second wiring layer is electrically connected with the driver IC chip through one or more of the plurality of interconnects extending through the substrate from the first side to the second side.

15. The electronic device of claim 14, further comprising a timing controller chip electrically connected with the second wiring layer.

16. The electronic device of claim 15, wherein the array of LEDs is located in a display area of the display substrate, and the plurality of interconnects are located outside of the display area.

17. The electronic device of claim 2, further comprising an electrically conductive top contact layer on and in electrical contact with the array of LEDs and one or more of the plurality of interconnects.

18. The electronic device of claim 17, further comprising a top encapsulation layer over the top contact layer.