Image sensor structures for fingerprint sensing
First Claim
1. A method of making an optical biometric sensor, comprising:
- forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer; and
after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors,wherein the forming the collimator filter layer includes forming the plurality of light collimating apertures and routing circuitry for light sensing elements of the image sensor wafer in one or more redistribution layers disposed on a front side of the image sensor wafer, andwherein the forming the plurality of light collimating apertures includes coating a light absorbing material on sidewalls of the light collimating apertures in the one or more redistribution layers.
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Abstract
Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.
94 Citations
17 Claims
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1. A method of making an optical biometric sensor, comprising:
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forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer; and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors, wherein the forming the collimator filter layer includes forming the plurality of light collimating apertures and routing circuitry for light sensing elements of the image sensor wafer in one or more redistribution layers disposed on a front side of the image sensor wafer, and wherein the forming the plurality of light collimating apertures includes coating a light absorbing material on sidewalls of the light collimating apertures in the one or more redistribution layers.
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2. A method of making an optical biometric sensor, comprising:
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forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer; and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors, wherein the forming the collimator filter layer on the image sensor wafer comprises; forming a collimator filter wafer having the plurality of light collimating apertures; and attaching the collimator filter wafer to the image sensor wafer. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of making an optical biometric sensor, comprising:
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forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer; and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors, wherein the forming the collimator filter layer on the image sensor wafer comprises; providing a wafer substrate having a back side and a polished front side opposite the back side, the wafer substrate having an initial thickness; forming a patterned mask layer on the polished front side, the patterned mask layer having a plurality of exposure holes through which the front side is exposed; etching the front side to form a plurality of vias through the exposure holes, each of the plurality of vias being free of conductive material and extending partially into the wafer substrate to a target depth less than the initial thickness; attaching the front side of the etched wafer substrate to the image sensor wafer; and thinning the etched wafer substrate, from the back side, to a target thickness, to expose the plurality of vias, wherein the exposed plurality of vias correspond to the plurality of light collimating apertures.
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13. A method of making an optical biometric sensor, comprising:
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forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer; and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors, wherein the forming the collimator filter layer comprises forming the plurality of light collimating apertures into a back side of the image sensor wafer, wherein a front side of the image sensor wafer includes one or more redistribution layers. - View Dependent Claims (14)
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15. An optical sensor wafer having a plurality of optical sensor devices for biometric sensing, comprising:
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an image sensor wafer comprising an array of light sensing devices; and a collimator filter layer disposed on the image sensor wafer, the collimator filter layer comprising an array of light collimating filter elements, wherein the array of light collimating filter elements is aligned with the array of light sensing devices, wherein the collimator filter layer comprises a plurality of scribe line pairs, each scribe line pair defining a removal region therebetween in the collimator filter wafer, wherein the image sensor wafer includes a bond pad pair under the removal region of the collimator filter wafer for each of the plurality of optical sensor devices. - View Dependent Claims (16, 17)
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Specification