Encapsulant with index matched thixotropic agent
First Claim
1. A light emitting diode (LED) package, comprising:
- an LED chip;
an encapsulant over said LED chip, said encapsulant comprising a first portion over said LED chip and a second portion over said first portion, at least one of said portions comprising an associated encapsulant refractive index;
a meniscus feature, in which an outer edge of the meniscus feature defines an outer boundary of said first and second encapsulant portions; and
a thickening material within at least one of said first and second portions, said material comprising a composite of two or more materials at least one of which comprises an index of refraction lower than said encapsulant refractive index and at least one of which comprises a material with a refractive index higher than said encapsulant refractive index, wherein the concentrations of said two or more materials within said at least one of said first and second portions are such that the combination of the two or more materials results in a refractive index that approaches said associated encapsulant refractive index.
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Accused Products
Abstract
Emitter packages are disclosed having a thixotropic agent or material, with the encapsulant exhibiting significant reduction of thixotropic agent scattering. The packages exhibit a corresponding reduction or elimination of encapsulant clouding and increased package emission efficiency. This allows for the thixotropic agents to be included in the encapsulant to alter certain properties (e.g. mechanical or thermal) while not significantly altering the optical properties of the encapsulant. One embodiment of a light emitting diode (LED) package according to the present invention comprises an LED chip with an encapsulant over the LED chip. The encapsulant has an encapsulant refractive index and also has a thixotropic material with a refractive index that is substantially the same as the encapsulant refractive index.
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Citations
21 Claims
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1. A light emitting diode (LED) package, comprising:
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an LED chip; an encapsulant over said LED chip, said encapsulant comprising a first portion over said LED chip and a second portion over said first portion, at least one of said portions comprising an associated encapsulant refractive index; a meniscus feature, in which an outer edge of the meniscus feature defines an outer boundary of said first and second encapsulant portions; and a thickening material within at least one of said first and second portions, said material comprising a composite of two or more materials at least one of which comprises an index of refraction lower than said encapsulant refractive index and at least one of which comprises a material with a refractive index higher than said encapsulant refractive index, wherein the concentrations of said two or more materials within said at least one of said first and second portions are such that the combination of the two or more materials results in a refractive index that approaches said associated encapsulant refractive index. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A light emitting diode (LED) package, comprising:
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an LED chip; an encapsulant over said LED chip, said encapsulant comprising an encapsulant refractive index; and a thickening material within the encapsulant, the thickening material comprising a composite of two or more oxide materials, said composite material comprising a refractive index that is within plus or minus n=0.05 of the encapsulant refractive index; wherein said thickening material comprises particles with a surface area greater than 100 meters squared per gram (m2/g). - View Dependent Claims (21)
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Specification