Coupling structures for electronic device housings
First Claim
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1. A housing for an electronic device, comprising:
- a first component;
a second component separated from the first component by a gap;
a first molded element disposed at least partially within the gap and defining;
at least a portion of an interlock feature; and
a textured surface; and
a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature and the textured surface, thereby retaining the second molded element to the first molded element;
whereinthe first component, the second component, and the second molded element form a portion of an exterior surface of the housing.
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Abstract
A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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Citations
22 Claims
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1. A housing for an electronic device, comprising:
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a first component; a second component separated from the first component by a gap; a first molded element disposed at least partially within the gap and defining; at least a portion of an interlock feature; and a textured surface; and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature and the textured surface, thereby retaining the second molded element to the first molded element;
whereinthe first component, the second component, and the second molded element form a portion of an exterior surface of the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A housing for an electronic device, comprising:
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a first component; a second component separated from the first component by a gap; and a joint structure disposed at least partially within the gap; wherein; the first component and the second component comprise flanges defining first and second portions, respectively, of a frame adapted to receive a transparent cover; a tooth of the joint structure extends past a ledge of the joint structure and forms a third portion of the frame; and the joint structure includes a support structure that supports the tooth. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A housing for an electronic device, comprising:
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a first housing portion forming a first portion of an exterior surface of the housing; a second housing portion separated from the first housing portion by a gap and forming a second portion of the exterior surface of the housing; and a joint structure disposed in the gap and comprising; a protrusion that defines a portion of a frame configured to receive a transparent cover; and a guide structure extending from a side of the protrusion to a lower portion of the protrusion and configured to bias at least a portion of the joint structure toward an interior of the housing in response to a narrowing of the gap. - View Dependent Claims (20, 21, 22)
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Specification