Integrated thermal management assembly for gate drivers and power components

• US 10,149,413 B1
• Filed: 07/31/2017
• Issued: 12/04/2018
• Est. Priority Date: 07/31/2017
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Inventors: Dede, Ercan M., Shin, Jongwon, Lee, Jae Seung
• Primary Examiner(s): Pape, Zachary
• Application Number:
  US15/665,158
• Time in Patent Office: 491 Days
• Field of Search: 36167946-67954, 361688-723, 165 801- 805, 16510433, 257712-722
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

An integrated thermal management assembly, device or system for a power conversion device having a driver board and a power board. The integrated thermal management assembly includes a double-sided cooler. The double-sided cooler has a first layer that includes a first surface that is positioned below an inner surface of the power board. The double-sided cooler has a second surface positioned above an inner surface of the driver board. The double-sided cooler includes a first coolant channel in between the first surface and the second surface. The thermal integrated assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler.

Claims

1. An integrated thermal management assembly for power conversion devices having a driver board and a power board, comprising:

a double-sided cooler having a first layer that includes a first coolant channel that is positioned between an inner surface of the power board and an inner surface of the driver board, the first coolant channel extending an entire length of at least one of the driver board or the power board;

a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler; and

a thermal interface material that is positioned between a surface of the power board and a surface of the first layer and provides a heat path for heat generated within the power board to travel to the coolant that flows within the first coolant channel.

2. The integrated thermal management assembly of claim 1, wherein the double-sided cooler has a second layer that includes a second coolant channel.

3. The integrated thermal management assembly of claim 2, wherein the coolant flows within the second coolant channel, wherein the coolant is either a liquid coolant or air.

4. The integrated thermal management assembly of claim 3, wherein the double-sided cooler has one or more fluid conduits that connects the first layer and the second layer and are configured to pass the coolant between the first coolant channel of the first layer and the second coolant channel of the second layer.

5. The integrated thermal management assembly of claim 4, wherein the one or more fluid conduits include a first fluid conduit that is positioned at one end of the double-sided cooler and a second fluid conduit that is positioned at an opposite end of the double-sided cooler.

6. The integrated thermal management assembly of claim 1, wherein the double-sided cooler has a second layer that has a second coolant channel and is configured as a heat spreader.

7. The integrated thermal management assembly of claim 6, wherein liquid evaporates or air flows within a connection to the second coolant channel.

8. The integrated thermal management assembly of claim 7, wherein the double-sided cooler has a heat pipe that connects the first layer and the second layer and is configured to pass the evaporated liquid between the first layer and the second layer.

9. The integrated thermal management assembly of claim 1, wherein an inner surface of the first coolant channel is shaped as a step or a fin to increase a surface area that is in contact with the coolant within the first coolant channel.

10. The integrated thermal management assembly of claim 1, wherein an amount of heat that is dissipated is directly correlated with an amount of surface area of an inner surface of the first coolant channel that is in contact with the coolant.

11. The integrated thermal management assembly of claim 1, wherein an inner surface of the first coolant channel has one or more recesses or fins to increase a surface area that is in contact with the coolant within the first coolant channel.

12. An integrated thermal management assembly for a power conversion device having a driver board and a power board, comprising:

a double-sided cooler positioned between the driver board and the power board and having a first layer that includes a first surface, a second surface and a first cavity in between the first surface and the second surface and extending an entire length of at least one of the driver board or the power board, the first surface having a recess or a step;

a coolant that flows within the first cavity and that is configured to dissipate heat projected through the double-sided cooler; and

a thermal interface material that is positioned between a surface of the power board and the first surface of the first layer and provides a heat path for heat generated within the power board to travel to the coolant that flows within the first cavity.

13. The integrated thermal management assembly of claim 12, wherein the coolant is a liquid coolant or air that dissipates the heat projected through the double-sided cooler.

14. The integrated thermal management assembly of claim 12, wherein the coolant is a liquid coolant, and wherein the double-sided cooler has a second layer that includes a second cavity.

15. The integrated thermal management assembly of claim 14, wherein the liquid coolant flows within the second cavity.

16. The integrated thermal management assembly of claim 15, wherein the double-sided cooler has a fluid conduit that connects the first layer and the second layer and is configured to pass the liquid coolant between the first layer and the second layer.

17. The integrated thermal management assembly of claim 12, wherein the double-sided cooler has a second layer that is a heat spreader and that includes a second cavity.

19. The integrated thermal management assembly of claim 12, wherein the first surface has the step.

18. The integrated thermal management assembly of 12, wherein passive electronic elements including magnetic or capacitor components that dissipate heat are embedded within the recess or step.

20. An integrated thermal management assembly for a power conversion device having a driver board and a power board, comprising:

a double-sided cooler positioned between the driver board and the power board and having a first layer that includes a first surface, a second surface and a first cavity in between the first surface and the second surface and a second layer that includes a second cavity; and

a liquid coolant that flows within the first cavity and the second cavity, the liquid coolant being configured to dissipate heat projected through the double-sided cooler.