Inspection for specimens with extensive die to die process variation

• US 10,151,706 B1
• Filed: 04/06/2017
• Issued: 12/11/2018
• Est. Priority Date: 04/07/2016
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Bhattacharyya, Santosh, Lee, Hucheng, Brauer, Bjorn
• Primary Examiner(s): Nguyen, Sang
• Application Number:
  US15/481,421
• Time in Patent Office: 614 Days
• CPC Class Codes: G01N 2021/8887 based on image processing techniques
• CPC Class Codes: G01N 21/8851 Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

Methods and systems for detecting defects on a specimen are provided. One method includes identifying first and second portions of dies on a specimen as edge dies and center dies, respectively. The method also includes determining first and second inspection methods for the first and second portions, respectively. Parameter(s) of comparisons performed in the first and second inspection methods are different. The method further includes detecting defects in at least one of the edge dies using the first inspection method and detecting defects in at least one of the center dies using the second inspection method.

Claims

1. A system configured to detect defects on a specimen, comprising:

an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a specimen, and wherein the detector is configured to detect energy from the specimen and to generate output responsive to the detected energy; and

one or more computer subsystems configured for;

identifying a first portion of dies on the specimen as edge dies based on positions of the dies on the specimen;

identifying a second portion of the dies on the specimen as center dies based on the positions of the dies on the specimen, wherein the center dies are located farther from an edge of the specimen than the edge dies;

determining a first inspection method for the first portion of the dies based on the positions of the edge dies on the specimen and a second inspection method for the second portion of the dies based on the positions of the center dies on the specimen, wherein one or more parameters of comparisons of the dies performed in the first inspection method are different than one or more parameters of comparisons of the dies performed in the second inspection method;

wherein the inspection subsystem generates the output for at least one of the edge dies and at least one of the center dies by directing the energy from the energy source to the specimen and detecting the energy from the specimen with the detector;

detecting defects in the at least one of the edge dies by performing the first inspection method for the at least one edge die in the first portion, wherein performing the first inspection method comprises performing the comparisons in the first inspection method with the output of the detector for the at least one edge die, and wherein the comparisons performed in the first inspection method comprise a first comparison of the output generated for a first of the edge dies with the output generated for a second of the edge dies adjacent to the first edge die on the specimen and a second comparison of the output generated for the first edge die with the output generated for a third of the edge dies adjacent to the first edge die on the specimen, and

detecting defects in the at least one of the center dies by performing the second inspection method for the at least one center die in the second portion, wherein performing the second inspection method comprises performing the comparisons in the second inspection method with the output of the detector for the at least one center die.

2. The system of claim 1, wherein said identifying the first and second portions of the dies is further based on the positions of the dies on the specimen and noise characteristics of the dies.

3. The system of claim 1, wherein the comparisons performed in the first inspection method do not include comparing the output generated for any of the edge dies with the output generated for any of the center dies, and wherein the comparisons performed in the second inspection method do not include comparing the output generated for any of the center dies with the output generated for any of the edge dies.

4. The system of claim 1, wherein the one or more computer subsystems are further configured for aligning the output generated in each die row on the specimen with a single reference die.

5. The system of claim 1, wherein the one or more computer subsystems are further configured for generating a simulated image illustrating how one or more of the dies will appear in the output generated by the detector and aligning the output generated in each die row on the specimen with the simulated image.

6. The system of claim 1, wherein the comparisons performed in the first inspection method further comprise third comparison of the output generated for the first edge die with the output generated for a fourth of the edge dies spaced from the first edge die on the specimen.

7. The system of claim 1, wherein the comparisons performed in the first inspection method further comprise a third comparison of the output generated for the first of the edge dies with the output generated for a fourth of the edge dies spaced from the first edge die on the specimen and a fourth comparison of the output generated for the first edge die with the output generated for one of the center dies on the specimen.

8. The system of claim 1, wherein the comparisons performed in the first inspection method further comprise a third comparison of the output generated for the first of the edge dies with the output generated for a fourth of the edge dies spaced from the first edge die on the specimen and a fourth comparison of the output generated for the first edge die with a design rendered image of the dies.

9. The system of claim 1, wherein the comparisons performed in the second inspection method comprise a first comparison of the output generated for a first of the center dies with the output generated for a second of the center dies adjacent to the first center die on the specimen and a second comparison of the output generated for the first center die with the output generated for a third of the center dies adjacent to the first center die on the specimen.

10. The system of claim 1, wherein the inspection subsystem further comprises a scanning subsystem configured to scan the energy directed to the specimen over the specimen as the detector detects the energy from the specimen, and wherein the one or more computer subsystems are further configured for determining a first scanning strategy performed by the scanning subsystem in the first inspection method and a second scanning strategy performed by the scanning subsystem in the second inspection method.

11. The system of claim 1, wherein the first inspection method comprises applying one or more first defect detection parameters to results of the comparisons performed in the first inspection method, and wherein the second inspection method comprises applying one or more second defect detection parameters to results of the comparisons performed in the second inspection method.

12. The system of claim 11, wherein the one or more first defect detection parameters are independent of the one or more second defect detection parameters.

13. The system of claim 11, wherein the one or more first defect detection parameters and the one or more second defect detection parameters are selected by a user.

14. The system of claim 1, wherein the specimen comprises a wafer.

15. The system of claim 1, wherein the energy directed to the specimen comprises light, and wherein the energy detected from the specimen comprises light.

16. The system of claim 1, wherein the energy directed to the specimen comprises electrons, and wherein the energy detected from the specimen comprises electrons.

17. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for detecting defects on a specimen, wherein the computer-implemented method comprises:

identifying a first portion of dies on a specimen as edge dies based on positions of the dies on the specimen;

identifying a second portion of the dies on the specimen as center dies based on the positions of the dies on the specimen, wherein the center dies are located farther from an edge of the specimen than the edge dies;

determining a first inspection method for the first portion of the dies based on the positions of the edge dies on the specimen and a second inspection method for the second portion of the dies based on the positions of the center dies on the specimen, wherein one or more parameters of comparisons of the dies performed in the first inspection method are different than one or more parameters of comparisons of the dies performed in the second inspection method;

generating output for at least one of the edge dies and at least one of the center dies with an inspection subsystem, wherein the inspection subsystem comprises at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to the specimen, wherein the detector is configured to detect energy from the specimen and to generate the output responsive to the detected energy, and wherein generating the output with the inspection subsystem comprises directing the energy from the energy source to the specimen and detecting the energy from the specimen with the detector;

detecting defects in the at least one of the edge dies by performing the first inspection method for the at least one edge die in the first portion, wherein performing the first inspection method comprises performing the comparisons in the first inspection method with the output of the detector of the inspection subsystem for the at least one edge die, and wherein the comparisons performed in the first inspection method comprise a first comparison of the output generated for a first of the edge dies with the output generated for a second of the edge dies adjacent to the first edge die on the specimen and a second comparison of the output generated for the first edge die with the output generated for a third of the edge dies adjacent to the first edge die on the specimen; and

detecting defects in the at least one of the center dies by performing the second inspection method for the at least one center die in the second portion, wherein performing the second inspection method comprises performing the comparisons in the second inspection method with the output of the detector for the at least one center die.

18. A computer-implemented method for detecting defects on a specimen, comprising:

identifying a first portion of dies on a specimen as edge dies based on positions of the dies on the specimen;

identifying a second portion of the dies on the specimen as center dies based on the positions of the dies on the specimen, wherein the center dies are located farther from an edge of the specimen than the edge dies;

determining a first inspection method for the first portion of the dies based on the positions of the edge dies on the specimen and a second inspection method for the second portion of the dies based on the positions of the center dies on the specimen, wherein one or more parameters of comparisons of the dies performed in the first inspection method are different than one or more parameters of comparisons of the dies performed in the second inspection method;

generating output for at least one of the edge dies and at least one of the center dies with an inspection subsystem, wherein the inspection subsystem comprises at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to the specimen, wherein the detector is configured to detect energy from the specimen and to generate the output responsive to the detected energy, and wherein generating the output with the inspection subsystem comprises directing the energy from the energy source to the specimen and detecting the energy from the specimen with the detector;

detecting defects in the at least one of the edge dies by performing the first inspection method for the at least one edge die in the first portion, wherein performing the first inspection method comprises performing the comparisons in the first inspection method with the output of the detector of the inspection subsystem for the at least one edge die, and wherein the comparisons performed in the first inspection method comprise a first comparison of the output generated for a first of the edge dies with the output generated for a second of the edge dies adjacent to the first edge die on the specimen and a second comparison of the output generated for the first edge die with the output generated for a third of the edge dies adjacent to the first edge die on the specimen; and

detecting defects in the at least one of the center dies by performing the second inspection method for the at least one center die in the second portion, wherein performing the second inspection method comprises performing the comparisons in the second inspection method with the output of the detector for the at least one center die, and wherein identifying the first portion, identifying the second portion, determining the first and second inspection methods, detecting defects in the at least one edge die, and detecting defects in the at least one center die are performed by one or more computer subsystems coupled to the inspection subsystem.

19. A system configured to detect defects on a specimen, comprising:

an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a specimen, and wherein the detector is configured to detect energy from the specimen and to generate output responsive to the detected energy; and

one or more computer subsystems configured for;

identifying a first portion of dies on the specimen as edge dies based on positions of the dies on the specimen;

identifying a second portion of the dies on the specimen as center dies based on the positions of the dies on the specimen, wherein the center dies are located farther from an edge of the specimen than the edge dies;

determining a first inspection method for the first portion of the dies based on the positions of the edge dies on the specimen and a second inspection method for the second portion of the dies based on the positions of the center dies on the specimen, wherein one or more parameters of comparisons of the dies performed in the first inspection method are different than one or more parameters of comparisons of the dies performed in the second inspection method;

wherein the inspection subsystem generates the output for at least one of the edge dies and at least one of the center dies by directing the energy from the energy source to the specimen and detecting the energy from the specimen with the detector;

detecting defects in the at least one of the edge dies by performing the first inspection method for the at least one edge die in the first portion, wherein performing the first inspection method comprises performing the comparisons in the first inspection method with the output of the detector for the at least one edge die, and wherein the comparisons performed in the first inspection method comprise a first comparison of the output generated for a first of the edge dies with the output generated for a second of the edge dies adjacent to the first edge die on the specimen and a second comparison of the output generated for the first edge die with the output generated for a third of the edge dies spaced from the first edge die on the specimen; and

detecting defects in the at least one of the center dies by performing the second inspection method for the at least one center die in the second portion, wherein performing the second inspection method comprises performing the comparisons in the second inspection method with the output of the detector for the at least one center die.

20. A system configured to detect defects on a specimen, comprising:

an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a specimen, and wherein the detector is configured to detect energy from the specimen and to generate output responsive to the detected energy; and

one or more computer subsystems configured for;

identifying a first portion of dies on the specimen as edge dies based on positions of the dies on the specimen;

identifying a second portion of the dies on the specimen as center dies based on the positions of the dies on the specimen, wherein the center dies are located farther from an edge of the specimen than the edge dies;

determining a first inspection method for the first portion of the dies based on the positions of the edge dies on the specimen and a second inspection method for the second portion of the dies based on the positions of the center dies on the specimen, wherein one or more parameters of comparisons of the dies performed in the first inspection method are different than one or more parameters of comparisons of the dies performed in the second inspection method;

wherein the inspection subsystem generates the output for at least one of the edge dies and at least one of the center dies by directing the energy from the energy source to the specimen and detecting the energy from the specimen with the detector;

detecting defects in the at least one of the edge dies by performing the first inspection method for the at least one edge die in the first portion, wherein performing the first inspection method comprises performing the comparisons in the first inspection method with the output of the detector for the at least one edge die; and

detecting defects in the at least one of the center dies by performing the second inspection method for the at least one center die in the second portion, wherein performing the second inspection method comprises performing the comparisons in the second inspection method with the output of the detector for the at least one center die, and wherein the comparisons performed in the second inspection method comprise a first comparison of the output generated for a first of the center dies with the output generated for a second of the center dies adjacent to the first center die on the specimen and a second comparison of the output generated for the first center die with the output generated for a third of the center dies adjacent to the first center die on the specimen.