Micro-transfer printable electronic component

• US 10,153,256 B2
• Filed: 12/09/2016
• Issued: 12/11/2018
• Est. Priority Date: 03/03/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Cok, Ronald S., Bower, Christopher, Meitl, Matthew, Prevatte, Jr., Carl
• Primary Examiner(s): Cao, Phat X
• Assistant Examiner(s): Vieira, Diana C
• Application Number:
  US15/373,865
• Publication Number:
  US 20170256521A1
• Time in Patent Office: 732 Days
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/82005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/13069 : Thin film transistor [TFT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/143 : Digital devices
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1531 : the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A micro-transfer printable electronic component includes one or more electronic components, such as integrated circuits or LEDs. Each electronic component has device electrical contacts for providing electrical power to the electronic component and a post side. A plurality of electrical conductors includes at least one electrical conductor electrically connected to each of the device electrical contacts. One or more electrically conductive connection posts protrude beyond the post side. Each connection post is electrically connected to at least one of the electrical conductors. Additional connection posts can form electrical jumpers that electrically connect electrical conductors on a destination substrate to which the printable electronic component is micro-transfer printed. The printable electronic component can be a full-color pixel in a display.

Claims

1. A micro-transfer printable electronic component, comprising:

a dielectric layer;

a plurality of electronic devices disposed in contact with the dielectric layer, each electronic device having an individual substrate and device electrical contacts for providing electrical power to the electronic device, the electronic device having a post side and an opposing stamp side;

a plurality of electrical conductors disposed at least partly in contact with the dielectric layer, at least one electrical conductor electrically connected to each of the device electrical contacts; and

one or more electrically conductive connection posts that protrude from the dielectric layer in a direction opposite to the stamp side, each connection post electrically connected to at least one of the electrical conductors and comprising a sharp point extending beyond the dielectric layer formed by a peak area smaller than a base area.

2. The micro-transfer printable electronic component of claim 1, wherein the dielectric layer is on or adjacent to the post side, wherein the dielectric layer is on or adjacent to the stamp side, or comprising one or more dielectric layers that are on both the stamp side and the post side.

3. The micro-transfer printable electronic component of claim 2, wherein the dielectric layer is transparent, the electronic devices include one or more LEDs, and the LEDs emit light through the transparent dielectric layer.

4. The micro-transfer printable electronic component of claim 2, wherein the electronic devices include one or more LEDs and the LEDs emit light in a direction opposite the dielectric layer.

5. The micro-transfer printable electronic component of claim 1, wherein the connection posts are first connection posts and comprising one or more electrically conductive additional connection posts that protrude beyond the post side, each additional connection post electrically connected with an electrical conductor to a first connection post or an additional connection post.

6. The micro-transfer printable electronic component of claim 1, wherein the electronic devices include a circuit controller electrically connected to at least one connection post and to at least one device electrical contact.

7. The micro-transfer printable electronic component of claim 1, comprising:

a display substrate having a plurality of contact pads or electrical conductors; and

wherein at least one connection post is in electrical contact with at least one contact pad or at least one electrical conductor.

8. The micro-transfer printable electronic component of claim 1, wherein the electronic component is an LED component having one or more LED electronic devices and an optional circuit controller and the device electrical contacts include LED electrical contacts.

9. The micro-transfer printable electronic component of claim 1, wherein the connection posts comprise an electrically conductive layer formed over a core of a different material.

10. The micro-transfer printable electronic component of claim 9, wherein the different material of the core is one or more of a dielectric, silicon dioxide, and silicon nitride.

11. The micro-transfer printable electronic component of claim 1, wherein the connection posts extend or electrically contact an electrical conductor through a via in a dielectric layer.

12. The micro-transfer printable electronic component of claim 1, wherein the electronic component is unpackaged and the electronic devices include one or more bare dies.

13. A micro-transfer printable electronic component wafer, comprising:

a wafer comprising a wafer material;

a patterned sacrificial layer forming sacrificial portions spaced apart by anchor portions formed on or in the wafer;

a plurality of micro-transfer printable electronic components, each micro-transfer printable electronic component formed entirely over one of the sacrificial portions and connected to an anchor portion of the anchor portions by a tether,

wherein each micro-transfer printable electronic component comprises;

a dielectric layer;

a plurality of electronic devices disposed in contact with the dielectric layer, each electronic device having an individual substrate and device electrical contacts for providing electrical power to the electronic device, the electronic device having a post side and an opposing stamp side;

a plurality of electrical conductors, at least one electrical conductor electrically connected to each of the device electrical contacts; and

one or more electrically conductive connection posts that protrude from the dielectric layer in a direction opposite to the stamp side, each connection post electrically connected to at least one of the electrical conductors.

14. A micro-transfer printable electronic component, comprising:

a dielectric layer;

a plurality of electronic devices disposed in contact with the dielectric layer, each electronic device having an individual substrate and device electrical contacts for providing electrical power to the electronic device, the electronic device having a post side and an opposing stamp side;

a plurality of electrical conductors, at least one electrical conductor electrically connected to each of the device electrical contacts;

one or more electrically conductive connection posts that protrude from the dielectric layer in a direction opposite to the stamp side, each connection post electrically connected to at least one of the electrical conductors; and

a tether or a fractured, broken, or separated tether, or wherein one or more of the electronic devices comprises a fractured, broken, or separated tether.