Semiconductor device and method for manufacturing the same
First Claim
Patent Images
1. A semiconductor device comprising:
- a non-single-crystal oxide semiconductor film as a channel formation region;
a source electrode and a drain electrode;
a gate insulating layer over the non-single-crystal oxide semiconductor film, the source electrode, and the drain electrode; and
a gate electrode layer over the gate insulating layer,wherein the non-single-crystal oxide semiconductor film comprises at least indium and gallium,wherein each of the source electrode and the drain electrode consists essentially of any one of molybdenum, titanium, tantalum, tungsten, copper, chromium, neodymium, and scandium,wherein a concentration of chlorine in the non-single-crystal oxide semiconductor film is lower than or equal to 2×
1018 atoms/cm3,wherein the non-single-crystal oxide semiconductor film has a density of higher than 6.0 g/cm3, andwherein a top surface of the non-single-crystal oxide semiconductor film is coplanar with a top surface of the source electrode and a top surface of the drain electrode.
0 Assignments
0 Petitions
Accused Products
Abstract
To manufacture a highly reliable semiconductor device by giving stable electric characteristics to a transistor. An oxide semiconductor film is deposited by a sputtering method with the use of a polycrystalline sputtering target. In that case, partial pressure of water in a deposition chamber before or in the deposition is set to be lower than or equal to 10−3 Pa, preferably lower than or equal to 10−4 Pa, more preferably lower than or equal to 10−5 Pa. Thus, a dense oxide semiconductor film is obtained. The density of the oxide semiconductor film is higher than 6.0 g/cm3 and lower than 6.375 g/cm3.
-
Citations
18 Claims
-
1. A semiconductor device comprising:
-
a non-single-crystal oxide semiconductor film as a channel formation region; a source electrode and a drain electrode; a gate insulating layer over the non-single-crystal oxide semiconductor film, the source electrode, and the drain electrode; and a gate electrode layer over the gate insulating layer, wherein the non-single-crystal oxide semiconductor film comprises at least indium and gallium, wherein each of the source electrode and the drain electrode consists essentially of any one of molybdenum, titanium, tantalum, tungsten, copper, chromium, neodymium, and scandium, wherein a concentration of chlorine in the non-single-crystal oxide semiconductor film is lower than or equal to 2×
1018 atoms/cm3,wherein the non-single-crystal oxide semiconductor film has a density of higher than 6.0 g/cm3, and wherein a top surface of the non-single-crystal oxide semiconductor film is coplanar with a top surface of the source electrode and a top surface of the drain electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A semiconductor device comprising:
-
an oxide semiconductor film comprising; a first region; and a pair of second regions, the first region located between the pair of second regions; a source electrode and a drain electrode; a gate insulating layer over the oxide semiconductor film, the source electrode, and the drain electrode; and a gate electrode layer over the gate insulating layer, wherein the oxide semiconductor film comprises at least indium, gallium, and zinc, wherein each of the source electrode and the drain electrode consists essentially of any one of molybdenum, titanium, tantalum, tungsten, copper, chromium, neodymium, and scandium, wherein the first region comprises a non-single-crystal oxide semiconductor film as a channel formation region, wherein a resistivity of the pair of second regions is lower than a resistivity of the first region, wherein a concentration of chlorine in the non-single-crystal oxide semiconductor film is lower than or equal to 2×
1018 atoms/cm3,wherein the non-single-crystal oxide semiconductor film has a density of higher than 6.0 g/cm3, and wherein a top surface of the non-single-crystal oxide semiconductor film is coplanar with a top surface of the source electrode and a top surface of the drain electrode. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
-
Specification