Techniques for designing millimeter wave printed dipole antennas
First Claim
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1. A printed dipole antenna, comprising:
- a first dipole wing and a second dipole wing; and
a balanced feeding structure comprising a first feed stripline connected to the first dipole wing and a second feed stripline connected to the second dipole wing, wherein a first portion of the first feed stripline and a first portion of the second feed stripline are printed on a layer between a first portion of a first ground layer of a substrate and a first portion of a second ground layer of the substrate.
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Abstract
A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.
31 Citations
11 Claims
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1. A printed dipole antenna, comprising:
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a first dipole wing and a second dipole wing; and a balanced feeding structure comprising a first feed stripline connected to the first dipole wing and a second feed stripline connected to the second dipole wing, wherein a first portion of the first feed stripline and a first portion of the second feed stripline are printed on a layer between a first portion of a first ground layer of a substrate and a first portion of a second ground layer of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A printed dipole antenna, comprising:
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a first dipole wing and a second dipole wing; and a balanced feeding structure comprising a feed stripline and a balun, wherein the feed stripline is printed on a layer between a portion of a first ground layer and a portion of a second ground layer of a substrate, wherein the first and second ground layers are separated by a via wall, the via wall comprising a plurality of vias, each via of the plurality of vias being disposed adjacent to another via of the plurality of vias. - View Dependent Claims (10, 11)
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Specification