Mechanical strain reduction on flexible and rigid-flexible circuits

• US 10,154,583 B1
• Filed: 03/25/2016
• Issued: 12/11/2018
• Est. Priority Date: 03/27/2015
• Status: Active Grant

• Current Assignee: Flex, Ltd.
• Original Assignee: Flex, Ltd.
• Inventors: Glickman, Michael James, Bergman, Mark, Vrtis, Joan
• Primary Examiner(s): Patel, Ishwarbhai B
• Application Number:
  US15/081,794
• Time in Patent Office: 991 Days
• CPC Class Codes: H05K 1/0281 Reinforcement details thereof
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09263 Meander

Abstract

A mechanical strain reduction system include a flexible circuit section of a printed circuit board configured with a meandering shape while in a static state, and a compressible material having a cavity such that the meandering flexible circuit section is positioned within the cavity while the flexible circuit section is in the static state. The flexible circuit section can be part of a rigid-flexible printed circuit board or a flexible printed circuit board. The cavity can be shaped with the same meandering shape as the flexible circuit section in the static state. In general, the cavity is sufficiently shaped to allow positioning of the meandering flexible circuit section within the cavity. Support structures of the same, or different, compressible material can be interspersed within the meander of the flexible circuit section.

Claims

1. A mechanical strain reduction system comprising:

a. a flexible circuit section having a meandering shape while in a static state, wherein the flexible circuit section comprises a flexible substrate and one or more electrically conductive traces coupled to the flexible substrate, wherein the flexible circuit section further comprises a first surface and a second surface opposite the first surface; and

b. a compressible material layer, wherein a cavity is formed in a first surface of the compressible material layer and the flexible circuit section is positioned within the cavity such that the first surface of the flexible circuit section is positioned on a bottom surface of the cavity and the second surface of the flexible circuit section is positioned within the cavity and is aligned below a top edge of the cavity on the first surface of the compressible material layer, the cavity having a shape that enables the flexible circuit section in the static state to be positioned within the cavity.

2. The mechanical strain reduction system of claim 1 wherein the meandering shape comprises a series of arched curves.

3. The mechanical strain reduction system of claim 2 wherein each arched curve has an angle between 45 and 300 degrees.

4. The mechanical strain reduction system of claim 1 wherein the meandering shape comprises a serpentine-like shape.

5. The mechanical strain reduction system of claim 1 wherein the flexible substrate comprises polyimide.

6. The mechanical strain reduction system of claim 1 wherein the one or more electrically conductive traces comprise copper conductors.

7. The mechanical strain reduction system of claim 1 wherein the shape of the cavity matches the meandering shape.

8. The mechanical strain reduction system of claim 1 further comprising one or more support structures within the cavity, wherein the flexible circuit section meanders around the one or more support structures.

9. The mechanical strain reduction system of claim 8 wherein the one or more support structures comprise the compressible material.

10. The mechanical strain reduction system of claim 1 wherein the flexible circuit section free-floats on a bottom surface of the cavity.

11. The mechanical strain reduction system of claim 1 wherein the flexible circuit section has a first end and a second end, further wherein the first end and the second end of the flexible circuit section are secured to a bottom surface of the cavity whereas a remaining portion of the flexible circuit section between the first end and the second end is free-floating on the bottom surface of the cavity.

12. The mechanical strain reduction system of claim 1 wherein an entirety of the flexible circuit section is positioned within the cavity.

13. The mechanical strain reduction system of claim 1 wherein the flexible circuit section has a first surface, a second surface opposite the first surface, and lateral side surfaces extending from the first surface to the second surface, wherein the lateral side surfaces are in contact with lateral side surfaces of the cavity.

14. The mechanical strain reduction system of claim 1 wherein the compressible material layer is foam.

15. A mechanical strain reduction system comprising:

a. a flexible circuit section having a meandering shape while in a static state, wherein the flexible circuit section comprises a flexible substrate and one or more electrically conductive traces coupled to the flexible substrate; and

b. a compressible material layer, wherein a cavity is formed in a first surface of the compressible material layer and the flexible circuit section is positioned within the cavity, the cavity having a shape that enables the flexible circuit section in the static state to be positioned within the cavity, further wherein the cavity has a cavity volume, and a portion of the cavity volume is unfilled by the flexible circuit section.

16. The mechanical strain reduction system of claim 15 wherein the portion of the cavity volume is air filled.

17. A mechanical strain reduction system comprising:

a. a flexible circuit section having a meandering shape while in a static state, wherein the flexible circuit section comprises a flexible substrate and one or more electrically conductive traces coupled to the flexible substrate, wherein the flexible circuit section has a first surface, a second surface opposite the first surface, and lateral side surfaces extending from the first surface to the second surface; and

b. a compressible material layer, wherein a cavity is formed in a first surface of the compressible material layer, the cavity having a shape that enables the flexible circuit section in the static state to be positioned within the cavity, further wherein a footprint of the flexible circuit section is smaller than a footprint of the cavity, and the flexible circuit section is positioned in the cavity such that the lateral side surfaces of the flexible circuit section do not contact lateral side surfaces of the cavity while in the static state.