Integral metallic joint based on electrodeposition
First Claim
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1. An electronic assembly, comprising:
- an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto sections of the adjoining casing parts abutting the gap region and bridges the gap region,wherein the mutually adjoining casing parts are joined by way of an adhesive, which substantially fills the gap region and is homogenously conductive.
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Abstract
An electronic assembly, including an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto the sections of the adjoining casing parts abutting the gap region and bridges the gap region.
8 Citations
13 Claims
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1. An electronic assembly, comprising:
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an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto sections of the adjoining casing parts abutting the gap region and bridges the gap region, wherein the mutually adjoining casing parts are joined by way of an adhesive, which substantially fills the gap region and is homogenously conductive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An electronic assembly, comprising:
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an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto sections of the adjoining casing parts abutting the gap region and bridges the gap region, wherein the electronic assembly is designed as an implantable electronic medical device, including as a cardiac pacemaker, a cardioverter, a cochlear implant, or a drug dosing pump, wherein the electrodeposited metal layer is provided on a feedthrough of the electronic medical device and bridges and seals the gap region between a flange part and a conductor element of the feedthrough, and wherein the flange part is made of titanium and partially provided with a noble metal additional part or a noble metal layer, and the conductor element comprises a plastic or ceramic substrate and is partially provided with a noble metal layer.
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Specification