In mold electronic printed circuit board encapsulation and assembly
First Claim
Patent Images
1. An assembly comprising:
- a heat sink comprising a thermally conductive thermoplastic polymer composition;
a first electrical/electronic component;
a second electrical/electronic component; and
a polyurethane,wherein the heat sink partially or fully surrounds the first electrical/electronic component, andwherein the polyurethane partially or fully surrounds the second electrical/electronic components to form the assembly,wherein the thermally conductive thermoplastic polymer composition comprises a blend selected from the group consisting of polycarbonate and polyethylene terephthalate, polycarbonate and polybutylene terephthalate, polycarbonate and polyphenylene sulfide, and polycarbonate and liquid crystalline polymers.
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Abstract
The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
119 Citations
27 Claims
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1. An assembly comprising:
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a heat sink comprising a thermally conductive thermoplastic polymer composition; a first electrical/electronic component; a second electrical/electronic component; and a polyurethane, wherein the heat sink partially or fully surrounds the first electrical/electronic component, and wherein the polyurethane partially or fully surrounds the second electrical/electronic components to form the assembly, wherein the thermally conductive thermoplastic polymer composition comprises a blend selected from the group consisting of polycarbonate and polyethylene terephthalate, polycarbonate and polybutylene terephthalate, polycarbonate and polyphenylene sulfide, and polycarbonate and liquid crystalline polymers. - View Dependent Claims (2, 3, 4)
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5. An assembly comprising:
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a heat sink comprising a thermally conductive thermoplastic polymer composition; a first electrical/electronic component; a second electrical/electronic component; and a polyurethane, wherein the heat sink partially or fully surrounds the first electrical/electronic component, and wherein the polyurethane partially or fully surrounds the second electrical/electronic components to form the assembly, wherein the thermally conductive thermoplastic polymer composition comprises expanded graphite in an amount of from 10 wt.-% to 70 wt.-% of the composition. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13)
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14. A process of making an assembly comprising:
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partially or fully surrounding a first electrical/electronic component with a heat sink comprising a thermally conductive thermoplastic polymer; partially or fully surrounding a second electrical/electronic component with a reaction injection molded polyurethane; and forming the assembly by interlocking the reaction injection molded polyurethane with the heat sink, wherein the thermally conductive thermoplastic polymer composition comprises a blend selected from the group consisting of polycarbonate and polyethylene terephthalate, polycarbonate and polybutylene terephthalate, polycarbonate and polyphenylene sulfide, and polycarbonate and liquid crystalline polymers. - View Dependent Claims (15, 16)
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17. A process of making an assembly comprising:
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partially or fully surrounding a first electrical/electronic component with a heat sink comprising a thermally conductive thermoplastic polymer; partially or fully surrounding a second electrical/electronic component with a reaction injection molded polyurethane; and forming the assembly by interlocking the reaction injection molded polyurethane with the heat sink, wherein the thermally conductive thermoplastic polymer composition comprises expanded graphite in an amount of from 10 wt.-% to 70 wt.-% of the composition. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A process of making an assembly comprising:
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partially or fully surrounding an LED printed circuit board with a heat sink comprising a thermally conductive thermoplastic polymer; partially or fully surrounding a driver/controller circuit board with a reaction injection molded polyurethane; and forming the assembly by interlocking the reaction injection molded polyurethane with the heat sink. - View Dependent Claims (26, 27)
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Specification