Method of making an accelerometer

• US 10,156,583 B2
• Filed: 02/24/2016
• Issued: 12/18/2018
• Est. Priority Date: 09/14/2012
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ma, Qing, Rao, Valluri, Eid, Feras, Lin, Kevin, Teh, Weng Hong, Swan, Johanna M., Sankman, Robert L.
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US15/051,856
• Publication Number:
  US 20160245841A1
• Time in Patent Office: 1,028 Days
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: G01P 15/105 by magnetically sensitive devices
• CPC Class Codes: G01P 15/18 in two or more dimensions

Abstract

A method of manufacturing an accelerometer, including placing a magnet on a substrate, laminating a dielectric layer over the magnet, forming a conductive layer over the dielectric layer, the conductive layer including a mass and a conductive path overlying the magnet, removing a portion of the dielectric layer proximate the mass and conductive path such that the mass is movable in response to acceleration of the accelerometer, and forming a dielectric layer over the mass to form a space between the mass and the dielectric layer formed over the mass sufficiently clear such that the mass remains movable.

Claims

1. A method of manufacturing an accelerometer, comprising:

placing a magnet on a substrate;

laminating a dielectric layer over the magnet;

forming a conductive layer over the dielectric layer, the conductive layer including a mass and a conductive path overlying the magnet;

removing a portion of the dielectric layer proximate the mass and the conductive path such that the mass is movable in response to acceleration of the accelerometer; and

forming a dielectric layer over the mass to form a space between the mass and the dielectric layer formed over the mass sufficiently clear such that the mass remains movable.

2. The method of claim 1, further comprising, before the removing:

providing an additional dielectric layer over the conductive layer; and

forming a plate protection mesh over the additional dielectric layer.

3. The method of claim 2, further comprising:

providing a photoresist layer over the plate protection mesh prior to the removing, the photoresist layer having an opening over the plate protection mesh.

4. The method of claim 3, further comprising removing the photoresist layer after the removing the portion of the dielectric layer and before the forming the dielectric layer over the mass.

5. The method of claim 1, wherein the forming the dielectric layer over the mass comprises laminating a dielectric film and the dielectric film comprises a final layer of a packaging of the accelerometer.