Semiconductor devices including a diode structure over a conductive strap and methods of forming such semiconductor devices
First Claim
Patent Images
1. A method for fabricating a semiconductor device, comprising:
- providing a first semiconductor substrate;
forming a first insulator material over the first semiconductor substrate;
providing a second semiconductor substrate comprising a single crystalline silicon material having a first doped region and a second doped region;
forming a conductive material over the second semiconductor substrate;
forming an amorphous adhesion material over and in direct contact with the conductive material, the amorphous adhesion, material comprising one or both of amorphous silicon and amorphous germanium; and
bonding the first and second substrates, to each other, the bonding comprising positioning the amorphous adhesion material directly against the insulator material over the first semiconductor substrate.
4 Assignments
0 Petitions
Accused Products
Abstract
Semiconductor devices including at least one diode over a conductive strap. The semiconductor device may include at least one conductive strap over an insulator material, at least one diode comprising a single crystalline silicon material over a conductive material, and a memory cell on the at least one diode. The at least one diode may be formed from a single crystalline silicon material. Methods of forming such semiconductor devices are also disclosed.
292 Citations
17 Claims
-
1. A method for fabricating a semiconductor device, comprising:
-
providing a first semiconductor substrate; forming a first insulator material over the first semiconductor substrate; providing a second semiconductor substrate comprising a single crystalline silicon material having a first doped region and a second doped region; forming a conductive material over the second semiconductor substrate; forming an amorphous adhesion material over and in direct contact with the conductive material, the amorphous adhesion, material comprising one or both of amorphous silicon and amorphous germanium; and bonding the first and second substrates, to each other, the bonding comprising positioning the amorphous adhesion material directly against the insulator material over the first semiconductor substrate. - View Dependent Claims (2, 3, 4)
-
-
5. A method for fabricating a semiconductor device, comprising:
-
forming an insulator material on d first semiconductor substrate; forming a conductive material and an adhesion material overlying a second semiconductor substrate; positioning the insulator material on the first semiconductor substrate in direct contact with the adhesion material and bonding the adhesion material of the second substrate to the insulator material to forma base comprising the first and second semiconductor substrates; forming a first doped region and a second doped region within a monocrystalline silicon material of the second semi conductor substrate; forming a bottom electrode over the second semiconductor substrate; removing a first portion of the bottom electrode, the second semiconductor substrate, the conductive material, and the adhesion material to form at least one conductive strap having a pillar of the bottom electrode and the second semiconductor substrate thereon; and removing a second portion of the bottom electrode and the second semiconductor substrate to form at least one diode over the at least one conductive strap wherein a portion of the bottom electrode overlies the at least one diode; and forming a memory medium over each portion of the bottom electrode. - View Dependent Claims (6, 7, 8, 9, 10, 11)
-
-
12. A method of forming a semiconductor device, comprising:
-
providing a first substrate comprising an insulator material; providing a second substrate comprising a conductive material; forming an amorphous adhesion material over the conductive material; forming a bonded structure by inverting the second substrate over the first substrate such that the amorphous adhesion material directly contacts the insulator material; forming trenches through the second substrate; forming at least one diode over the conductive material in the bonded structure. - View Dependent Claims (13, 14, 15, 16, 17)
-
Specification