3DIC packaging with hot spot thermal management features
First Claim
Patent Images
1. A package comprising:
- a substrate comprising a conductive layer;
a first die stack over the substrate and electrically connected to the conductive layer;
a second die stack over the substrate and adjacent the first die stack, wherein the first die stack extends higher than the second die stack;
a thermally conductive material over the substrate and contacting an electrically conductive material of conductive layer; and
a heat dissipation feature thermally connected to the electrically conductive material through the thermally conductive material, wherein a first bottom surface of the heat dissipation feature over the first die stack is higher than a second bottom surface of the heat dissipation feature over the second die stack, and wherein a portion of the heat dissipation feature extends between the first die stack and the second die stack along a line parallel to a top surface of the substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
-
Citations
20 Claims
-
1. A package comprising:
-
a substrate comprising a conductive layer; a first die stack over the substrate and electrically connected to the conductive layer; a second die stack over the substrate and adjacent the first die stack, wherein the first die stack extends higher than the second die stack; a thermally conductive material over the substrate and contacting an electrically conductive material of conductive layer; and a heat dissipation feature thermally connected to the electrically conductive material through the thermally conductive material, wherein a first bottom surface of the heat dissipation feature over the first die stack is higher than a second bottom surface of the heat dissipation feature over the second die stack, and wherein a portion of the heat dissipation feature extends between the first die stack and the second die stack along a line parallel to a top surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method comprising:
-
forming a conductive layer at a front side of a package substrate; forming a solder resist over the front side of the package substrate; patterning a first opening exposing a first portion of the conductive layer through the solder resist; patterning a second opening exposing a second portion of the conductive layer through the solder resist, the second portion of the conductive layer being electrically connected to the first portion of the conductive layer; attaching a die stack to the package substrate, wherein the die stack is electrically connected to the conductive layer, and wherein the die stack comprises one or more top dies bonded to a bottom die; disposing a first thermally conductive material in the first opening and physically contacting the first portion of the conductive layer; disposing a second thermally conductive material in the second opening and physically contacting the second portion of the conductive layer, wherein a line perpendicular to a top surface of the package substrate extends through the package substrate, the second thermally conductive material, and the one or more top dies; and attaching a heat dissipation feature to the package substrate, wherein the heat dissipation feature is thermally connected to the second thermally conductive material through the first thermally conductive material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A package comprising:
-
a die stack bonded to a front side of a package substrate, wherein the die stack is electrically connected to a conductive layer at a front side of the package substrate; a first material over and physically contacting an electrically conductive material of the conductive layer, wherein the first material has a thermal conductivity between 3 W/m·
K and 50 W/m·
K; anda heat dissipation feature attached to the front side of the package substrate using an adhesive having a lower thermal conductivity than the first material, wherein the heat dissipation feature is in physical contact with the first material, and wherein the adhesive is disposed on opposing sidewalls of the first material. - View Dependent Claims (18, 19, 20)
-
Specification