Micro-transfer printing with volatile adhesive layer

• US 10,157,880 B2
• Filed: 09/28/2017
• Issued: 12/18/2018
• Est. Priority Date: 10/03/2016
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bonafede, Salvatore, Meitl, Matthew, Cok, Ronald S.
• Primary Examiner(s): Thai, Luan C
• Application Number:
  US15/718,636
• Publication Number:
  US 20180096964A1
• Time in Patent Office: 446 Days
• Field of Search: 257783
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16507 comprising an intermetallic compound
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32227 the layer connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32503 comprising an intermetallic compound
• CPC Class Codes: H01L 2224/81002 being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/81097 Heating
• CPC Class Codes: H01L 2224/81192 wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8121 using a reflow oven
• CPC Class Codes: H01L 2224/81409 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/81411 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81413 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/81439 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/81444 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/81455 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/8181 : involving forming an intermetallic compound at the bonding interface
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/8182 : Diffusion bonding
• CPC Class Codes: H01L 2224/81907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/83002 : being a removable or sacrificial coating
• CPC Class Codes: H01L 2224/83097 : Heating
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/832 : Applying energy for connecting
• CPC Class Codes: H01L 2224/8321 : using a reflow oven
• CPC Class Codes: H01L 2224/83409 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/83411 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/83413 : Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/83416 : Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/83439 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/83444 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/83447 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/83455 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/83469 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/838 : Bonding techniques
• CPC Class Codes: H01L 2224/83801 : Soldering or alloying
• CPC Class Codes: H01L 2224/8381 : involving forming an intermetallic compound at the bonding interface
• CPC Class Codes: H01L 2224/83815 : Reflow soldering
• CPC Class Codes: H01L 2224/8382 : Diffusion bonding
• CPC Class Codes: H01L 2224/83907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 2224/83948 : Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 : Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of making a micro-transfer printed structure includes providing a destination substrate and a source substrate having one or more micro-transfer printable components. A layer of volatile adhesive is formed over the destination substrate and one or more components are micro-transfer printed from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer. The volatile adhesive layer is then heated to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing. In certain embodiments, a micro-transfer printed structure includes a destination substrate having one or more metal contacts and one or more micro-transfer printable components having one or more component contacts disposed on the destination substrate with the metal contact aligned with the component contact. The metal contact can form an intermetallic bond with the component contact.

Claims

1. A method of making a micro-transfer printed structure, comprising:

providing a destination substrate;

providing a source substrate comprising one or more micro-transfer printable components;

forming a layer of volatile adhesive over the destination substrate;

micro-transfer printing one or more of the one or more micro-transfer printable components from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer; and

heating the volatile adhesive layer to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing.

2. The method of claim 1, wherein the volatile adhesive layer is patterned.

3. The method of claim 1, wherein the volatile adhesive layer is unpatterned.

4. The method of claim 1, wherein heating the volatile adhesive layer renders at least a portion of the volatile adhesive gaseous.

5. The method of claim 1, wherein heating the volatile adhesive layer drives at least a portion of the adhesive through the surface of and into at least one of (i) the destination substrate and (ii) the component.

6. The method of claim 1, wherein the one or more micro-transfer printed components each comprise one or more electrically conductive component contacts.

7. The method of claim 1, comprising providing one or more electrically conductive metal contacts disposed on, in, or over the destination substrate.

8. The method of claim 7, wherein each metal contact is one or more of a solderable material, a metal alloy, and a metal alloy comprising at least one of gold, tin, lead, bismuth, indium, nickel, silver, platinum, and copper.

9. The method of claim 7, comprising diffusing a portion of the adhesive into the one or more metal contacts.

10. The method of claim 7, wherein

the forming step comprises forming the volatile adhesive layer on the one or more metal contacts;

the heating step causes at least a portion of at least one of the one or more metal contacts to melt; and

the method comprises cooling the at least one metal contact to a temperature at which the at least a portion of the at least one metal contact solidifies in order to adhere at least one of the one or more components to the at least one metal contact.

11. The method of claim 7, wherein the one or more metal contacts are one or more designated portions of an unpatterned metal layer or one or more portions of a patterned metal layer.

12. The method of claim 10, wherein each of the one or more micro-transfer printed components has a printing surface and a flat opposing surface and comprises one or more electrically conductive component contacts electrically connected to electrical elements in the component, the micro-transfer printing step comprises contacting each printing surface with a stamp, releasing each component from the source substrate, and pressing each component contact of the one or more micro-transfer printed components to the adhesive layer, and wherein the steps of heating and cooling form an electrical connection between the at least one metal contact and one or more of the component contacts of the one or more micro-transfer printed components.

13. The method of claim 12, wherein each of the component contacts are one or more of a semiconductor, a compound semiconductor, silicon, GaAs, InGaAs, InP, GaN, and InGaN.

14. The method of claim 12, comprising diffusing at least one of (i) a material of one or more of the one or more metal contacts into one or more of the component contact(s) of the one or more micro-transfer printed components and (ii) a material of one or more of the component contact(s) diffuses into the metal contact.

15. The method of claim 12, comprising wetting a component contact of the one or more micro-transfer printed components with material of the one or more metal contacts.

16. The method of claim 12, comprising diffusing adhesive into the one or more component contacts.

17. The method of claim 6, comprising:

providing one or more electrically conductive metal contacts disposed on, in, or over the destination substrate, wherein

the forming step comprises forming the volatile adhesive layer on the one or more metal contacts;

the heating step causes at least a portion of at least one component contact to melt; and

the method comprises cooling the at least one component contact to a temperature at which the at least a portion of the at least one component solidifies in order to adhere at least one of the one or more components to the at least one metal contact.

18. The method of claim 1, wherein micro-transfer printing comprises, for each micro-transfer printable component being micro-transfer printed, breaking one or more tethers that connect the micro-transfer printable component to the source substrate.

19. The method of claim 1, wherein the component has at least one of a length, width and height dimension that is less than or equal to one micron, less than or equal to two microns, less than or equal to five microns, less than or equal to ten microns, less than or equal to twenty microns, less than or equal to fifty microns, or less than or equal to one hundred microns.

20. A method of making a micro-transfer printed structure, comprising:

providing a destination substrate comprising one or more electrically conductive metal contacts;

providing a source substrate comprising one or more micro-transfer printable components, each component comprising one or more electrically conductive component contacts;

forming a layer of volatile adhesive over the destination substrate;

micro-transfer printing one or more micro-transfer printable components from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer such that the component contact(s) of the one or more micro-transfer printable components micro-transfer printed from the source substrate are in alignment with and adhered to the one or more metal contacts;

heating the volatile adhesive layer to an evaporation temperature to evaporate the volatile adhesive after micro-transfer printing; and

cooling the component(s) and metal contact(s) to adhere the one or more components micro-transfer printed from the source substrate to the one or more metal contacts and form an electrical connection between the one or more metal contacts and the component contact(s) of the one or more micro-transfer printed components micro-transfer printed from the source substrate.

21. The method of claim 20, wherein the one or more metal contacts form corresponding intermetallic bond(s) with the component contact.