Cross-point memory and methods for fabrication of same
First Claim
1. A method, comprising:
- forming a memory cell line stack extending in a first direction, comprising;
forming a memory cell material stack comprising a storage element material and a selector element material;
patterning the memory cell material stack to form the memory cell line stack comprising a storage material line and a selector material line;
forming a protective dielectric material on portions of sidewalls of the memory cell line stack, comprising;
forming an initial protective dielectric material covering the memory cell line stack; and
removing a portion of the initial protective dielectric material to expose sidewalls of one of the storage material line or the selector material line while leaving the initial protective dielectric material on at least portions of the sidewalls of the other of the storage material line or the selector material line.
4 Assignments
0 Petitions
Accused Products
Abstract
The disclosed technology relates generally to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same. In one aspect, a memory device of the memory array comprises a substrate and a memory cell stack formed between and electrically connected to first and second conductive lines. The memory cell stack comprises a first memory element over the substrate and a second memory element formed over the first element, wherein one of the first and second memory elements comprises a storage element and the other of the first and second memory elements comprises a selector element. The memory cell stack additionally comprises a first pair of sidewalls opposing each other and a second pair of sidewalls opposing each other and intersecting the first pair of sidewalls. The memory device additionally comprises first protective dielectric insulating materials formed on a lower portion of the first pair of sidewalls and an isolation dielectric formed on the first protective dielectric insulating material and further formed on an upper portion of the first pair of sidewalls.
41 Citations
18 Claims
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1. A method, comprising:
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forming a memory cell line stack extending in a first direction, comprising; forming a memory cell material stack comprising a storage element material and a selector element material; patterning the memory cell material stack to form the memory cell line stack comprising a storage material line and a selector material line; forming a protective dielectric material on portions of sidewalls of the memory cell line stack, comprising; forming an initial protective dielectric material covering the memory cell line stack; and removing a portion of the initial protective dielectric material to expose sidewalls of one of the storage material line or the selector material line while leaving the initial protective dielectric material on at least portions of the sidewalls of the other of the storage material line or the selector material line. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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forming a first protective dielectric material over sidewalls of a lower line memory cell stack; etching a portion of the first protective dielectric material in a first direction; filling a region between the lower line memory cell stack and a second lower line memory cell stack with a first isolation dielectric material after etching the portion; depositing a conductive material over the first isolation dielectric material; etching a portion of the lower line memory cell stack and the conductive material in the first direction; and forming a second protective dielectric material over sidewalls of an unetched portion of the lower line memory cell stack and the conductive material. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification