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Fusion bonded liquid crystal polymer circuit structure

  • US 10,159,154 B2
  • Filed: 09/24/2015
  • Issued: 12/18/2018
  • Est. Priority Date: 06/03/2010
  • Status: Active Grant
First Claim
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1. A method of making, a multilayered, fusion bonded circuit structure comprising the steps of:

  • attaching a first circuitry layer to a first major surface of a first liquid crystal polymer (LCP) substrate;

    forming a plurality of first vias extending from a second major surface of the first substrate to the first circuitry layer;

    plating the first vias;

    applying a photo sensitive material to the first circuitry laver;

    imaging the photo sensitive material to create a plurality of first recesses that expose locations on the first circuitry layer;

    plating the first recesses to form a plurality of first conductive pillars of solid metal that substantially fill the first recesses, the first conductive pillars extending above the first major surface of the first substrate;

    forming a plurality of second recesses in a second LCP substrate corresponding to the plurality of the first conductive pillars;

    plating the second recesses to form a plurality of second conductive structures that, extend between first and second major surfaces of the second substrate;

    aligning the first conductive pillars with the second conductive structures;

    positioning distal ends of the first conductive pillars at least partially in the second recesses of the second substrate before the fusion bonding step; and

    fusion bonding the first and second LCP substrates to mechanically and electrically couple the first conductive pillars to the second conductive structures.

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