MEMS devices and fabrication methods thereof
First Claim
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1. A semiconductor device comprising:
- a carrier having a plurality of cavities;
a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises;
a first side bonded on the carrier;
a first moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon; and
a second side having a plurality of bonding pads; and
a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode, and wherein the first moving element is between the top electrode and the bottom electrode.
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Abstract
A device includes a carrier having a plurality of cavities, a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises a first side bonded on the carrier, a moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon and a second side having a plurality of bonding pads and a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode and the first moving element is between the top electrode and the bottom electrode.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a carrier having a plurality of cavities; a micro-electro-mechanical system (MEMS) substrate bonded on the carrier, wherein the MEMS substrate comprises; a first side bonded on the carrier; a first moving element over a bottom electrode, wherein the bottom electrode is formed of polysilicon; and a second side having a plurality of bonding pads; and a semiconductor substrate bonded on the MEMS substrate, wherein the semiconductor substrate comprises a top electrode, and wherein the first moving element is between the top electrode and the bottom electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus comprising:
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a carrier having a plurality of cavities; a micro-electro-mechanical system (MEMS) device bonded on the carrier, wherein the MEMS device comprises; a first side bonded on the carrier; a moving element over a bottom electrode; an anchor region formed adjacent to the first side of the MEMS device, and wherein three sides of the anchor region are wrapped by a polysilicon layer; and a second side having a plurality of bonding pads; and a semiconductor substrate bonded on the MEMS device, wherein the semiconductor substrate comprises a top electrode, and wherein the moving element is between the top electrode and the bottom electrode. - View Dependent Claims (12, 13, 14, 15)
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16. A device comprising:
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a carrier having a plurality of cavities, wherein a first opening of a first cavity is covered by a bonding interface layer and a second opening of the first cavity is exposed through a gap between two adjacent bonding interface layers; a micro-electro-mechanical system (MEMS) device bonded on the carrier, wherein the MEMS device comprises; the bonding interface layer on a first side of the MEMS device; a dielectric layer on the bonding interface layer; a bottom electrode over the dielectric layer; a first moving element over the bottom electrode; and a semiconductor substrate bonded on a second side of the MEMS substrate, wherein the semiconductor substrate comprises a top electrode, and wherein the first moving element is between the bottom electrode and the top electrode. - View Dependent Claims (17, 18, 19, 20)
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Specification