Method and apparatus for a semiconductor structure

• US 10,160,638 B2
• Filed: 01/04/2013
• Issued: 12/25/2018
• Est. Priority Date: 01/04/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chu, Li-Cheng, Liu, Ping-Yin, Huang, Xin-Hua, Hsieh, Yuan-Chih, Chao, Lan-Lin, Cheng, Chun-Wen
• Primary Examiner(s): Gebremariam, Samuel
• Application Number:
  US13/734,146
• Publication Number:
  US 20140191341A1
• Time in Patent Office: 2,181 Days
• CPC Class Codes: B81B 2207/017 Smart-MEMS not provided for in B81B2207/012 - B81B2207/015
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure

Abstract

A semiconductor structure may include a first device having first surface with a first bonding layer formed thereon and a second device having a first surface with a second bonding layer formed thereon. The first bonding layer may provide an electrically conductive path to at least one electrical device in the first device. The second bonding layer may provide an electrically conductive path to at least one electrical device in the second device. One of the first or the second devices may include MEMS electrical devices. The first and/or the second bonding layers may be formed of a getter material, which may provide absorption for outgassing.

Claims

1. An apparatus, comprising:

a first device having active devices in a first substrate, a first bonding layer extending along the first substrate, the first bonding layer having a first bonding surface and providing electrical connection to the active devices;

a second device having a MEMS-type electrical device over a second substrate, a second bonding layer extending along the second substrate, the second bonding layer having a second bonding surface and providing electrical connection to the MEMS-type electrical device;

a structural feature extending from the first substrate towards the second substrate, the structural feature being a semiconductor material, the first bonding layer extending along and physically contacting a sidewall of the structural feature, the first bonding layer electrically connect connecting the active devices of the first device and the MEMS-type electrical device of the second device; and

wherein the first bonding layer and the second bonding layer are bonded together, a micro chamber being formed between the first device and the second device, and at least one of the first bonding layer or the second bonding layer comprises a getter material extending throughout its volume and exposed to the micro chamber, wherein a portion of the getter material extends continuously as an unbroken region from outside the micro chamber to within the micro chamber including along at least one of the first bonding surface or the second bonding surface, and within the micro chamber; and

wherein the first bonding layer comprises a first layer comprising the getter material and a second layer comprising a eutectic metal material.

2. The apparatus of claim 1, wherein the second bonding layer comprises a first layer comprising the getter material and a second layer comprising a eutectic metal material.

3. The apparatus of claim 1, wherein the getter material comprises a material selected from a group consisting of zirconium, barium, titanium, an aluminum-based alloy and combinations thereof.

4. The apparatus of claim 1, wherein the first bonding layer or the second bonding layer comprise a eutectic alloy material.

5. The apparatus of claim 1, wherein the first bonding layer or the second bonding layer comprise a material selected from a group consisting of indium, gold, tin, copper and combinations thereof.

6. The apparatus of claim 1, wherein at least one of the first device or the second device has electrical devices formed therein.

7. The apparatus of claim 1, wherein the MEMS-type electrical device is exposed to the micro chamber.

8. The apparatus of claim 1, wherein the first bonding layer comprises a first portion extending along the first substrate of the first device and a second portion extending along the first substrate of the first device, wherein the first portion and the second portion are separated by an opening.

9. An apparatus comprising:

a device having a substrate, active devices in the substrate, a structural feature extending from the substrate, a MEMS-type device in the cavity, the structural feature being a semiconductor material; and

a bonding layer including a conductive getter material extending continuously as a single unbroken region from a first surface of the cavity, along and physically contacting a first sidewall surface of the structural feature inside the cavity, and along and physically contacting a second sidewall surface of the structural feature outside the cavity, wherein the bonding layer electrically connects the active devices to the MEMS-type device.

10. The apparatus of claim 9, wherein the conductive getter material comprises a material selected from a group consisting of zirconium, barium, titanium, an aluminum-based alloy and combinations thereof.

11. The apparatus of claim 9, wherein the bonding layer is formed to a thickness of approximately 200 nm to approximately 5000 nm.

12. A device comprising:

a first structural feature adhered to a substrate, the substrate comprising active devices, the first structural feature having a connecting portion extending away from the substrate, the first structural feature being a semiconductor material;

a second structural feature adhered to a MEMS electrical device;

a first bonding layer bonding the first structural feature to the second structural feature, a micro chamber being formed between the first structural feature and the second structural feature, the MEMS electrical device exposed to the micro chamber, the first bonding layer comprising an eutectic metal material and a getter material extending continuously as an unbroken region from outside the micro chamber to within the micro chamber, the first bonding layer physically contacting a first sidewall surface of the first structural feature inside the micro chamber, the first bonding layer physically contacting a second sidewall surface of the first structural feature outside the micro chamber; and

a via extending through the first structural feature, the via and the first bonding layer forming an electrically conductive pathway connecting the active devices to the MEMS electrical device.

13. The device of claim 12, wherein the first bonding layer comprises:

a first layer of the getter material; and

a second layer of the eutectic metal material.

14. The device of claim 12, wherein the first structural feature is adhered to the substrate by a first dielectric layer, the via extending through the first dielectric layer.

15. The device of claim 12, wherein the first bonding layer extends along a top surface of the first structural feature.

16. The device of claim 15, further comprising:

a second bonding layer extending along a top surface of the second structure feature, the second bonding layer bonded to the first bonding layer, the second bonding layer comprising the eutectic metal material and the getter material, the second bonding layer extending continuously as an unbroken region from outside the micro chamber to within the micro chamber.

17. The device of claim 15, wherein the first bonding layer includes openings defining multiple electrically conductive regions.

18. The device of claim 12, wherein the getter material is one of zirconium, barium, titanium, an aluminum-based alloy, or combinations thereof.

19. The device of claim 12, wherein the eutectic metal material is one of indium, gold, tin, copper, or combinations thereof.

20. The device of claim 12, wherein the first and second structure features are not electrically conductive.