Wafer level packaging of infrared camera detectors
First Claim
1. An infrared detector, comprising:
- a first substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof;
a second substrate having side walls and a generally planar window spaced above the array, the window being substantially transparent to infrared light,wherein the side walls are disposed on an upper surface of the first substrate and define a closed cavity between the first and second substrates that enclose the array;
a solder seal bonding a perimeter of the side walls of the second substrate to the first substrate so as to seal the cavity; and
at least one solder capture ring fully disposed around and/or within a perimeter of the solder seal and disposed on the first substrate adjacent to the side walls.
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Accused Products
Abstract
An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.
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Citations
20 Claims
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1. An infrared detector, comprising:
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a first substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof; a second substrate having side walls and a generally planar window spaced above the array, the window being substantially transparent to infrared light, wherein the side walls are disposed on an upper surface of the first substrate and define a closed cavity between the first and second substrates that enclose the array; a solder seal bonding a perimeter of the side walls of the second substrate to the first substrate so as to seal the cavity; and at least one solder capture ring fully disposed around and/or within a perimeter of the solder seal and disposed on the first substrate adjacent to the side walls. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for making an infrared detector, the method comprising:
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providing a window wafer comprised of a semiconductor; forming an array of cavities in a surface of the window wafer, each cavity defining a window substantially transparent to infrared light and surrounded by side walls, adjacent rows and columns of the array being separated from each other by dicing lanes; providing a detector wafer having an upper surface with an array of infrared detector arrays corresponding in size and location to be disposed within the array of cavities in the window wafer, and a corresponding array of readout integrated circuits respectively interconnected with associated ones of the infrared detector arrays disposed thereon, adjacent rows and columns of the infrared detector arrays being separated from each other by dicing lanes; forming an array of solder seals on the upper surface of the detector wafer respectively corresponding in size and location to the side walls on the window wafer; forming at least one solder capture ring on the detector wafer around and/or within a perimeter of each of the solder seals thereon; aligning the window wafer over the detector wafer such that the cavities of the window wafer are respectively disposed over corresponding ones of the infrared detector arrays; bonding lower surfaces of the side walls with the upper surface of the detector wafer such that each of the cavities is sealed and a plurality of infrared detectors is defined between the two wafers; evacuating at least partially each of the cavities; and fusing the solder seals with the corresponding side walls on the upper surface of the detector wafer. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification