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Wafer level packaging of infrared camera detectors

  • US 10,161,803 B2
  • Filed: 12/05/2016
  • Issued: 12/25/2018
  • Est. Priority Date: 07/27/2010
  • Status: Active Grant
First Claim
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1. An infrared detector, comprising:

  • a first substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof;

    a second substrate having side walls and a generally planar window spaced above the array, the window being substantially transparent to infrared light,wherein the side walls are disposed on an upper surface of the first substrate and define a closed cavity between the first and second substrates that enclose the array;

    a solder seal bonding a perimeter of the side walls of the second substrate to the first substrate so as to seal the cavity; and

    at least one solder capture ring fully disposed around and/or within a perimeter of the solder seal and disposed on the first substrate adjacent to the side walls.

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